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3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme

Autor Yangdong Deng, Wojciech P. Maly
en Limba Engleză Hardback – 21 iun 2010
"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D.
Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA.
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Specificații

ISBN-13: 9783642041563
ISBN-10: 3642041566
Pagini: 200
Ilustrații: 200 p. 50 illus.
Dimensiuni: 155 x 235 x 15 mm
Greutate: 0.44 kg
Ediția:2010
Editura: Springer Berlin, Heidelberg
Colecția Springer
Locul publicării:Berlin, Heidelberg, Germany

Public țintă

Research

Cuprins

A Cost Comparison of VLSI Integration Schemes.- Design Case Studies.- An Automatic 2.5-D Layout Design Flow.- Floorplanning for 2.5-D Integration.- Placement for 2.5-D Integration.- A Road map of 2.5-D Integration.- Conclusion and Future Work.

Caracteristici

A new integration scheme considering both performance and yield Novel cost model to compare difference integration styles Design driven approach to prove the performance advantages of 2.5/3-D IC's Full EDA tool support for 3-D layout creation