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3D IC Stacking Technology de Banqiu Wu

3D IC Stacking Technology

Autor Banqiu Wu, Ajay Kumar, Sesh Ramaswami
en Limba Engleză Hardback – 16 sep 2011

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.


The latest advances in three-dimensional integrated circuit stacking technology

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.
3D IC Stacking Technology covers:
  • High density through silicon stacking (TSS) technology
  • Practical design ecosystem for heterogeneous 3D IC products
  • Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack
  • Process integration for TSV manufacturing
  • High-aspect-ratio silicon etch for TSV
  • Dielectric deposition for TSV
  • Barrier and seed deposition
  • Copper electrodeposition for TSV
  • Chemical mechanical polishing for TSV applications
  • Temporary and permanent bonding
  • Assembly and test aspects of TSV technology
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Specificații

ISBN-13: 9780071741958
ISBN-10: 007174195X
Pagini: 544
Dimensiuni: 160 x 236 x 23 mm
Greutate: 0.78 kg
Editura: McGraw Hill Education
Colecția McGraw-Hill
Locul publicării:United States

Cuprins

Chapter 1. Introduction to High-Density Through Silicon Stacking Technology
Chapter 2. A Practical Design Eco-System for Heterogeneous 3D IC Products
Chapter 3. Design Automation and TCAD Tool Solutions for Through Silicon Via-Based 3D IC Stack
Chapter 4. Process Integration for TSV Manufacturing
Chapter 5. High-Aspect-Ratio Silicon Etch for TSV
Chapter 6. Dielectric Deposition for Through Silicon Vias
Chapter 7. Barrier and Seed Deposition
Chapter 8. Copper Electrodeposition for TSV
Chapter 9. Chemical Mechanical Polishing for TSV
Chapter 10. Temporary and Permanent Bonding
Chapter 11. Assembly and Test Aspects of TSV Technology
Index