Adhesion in Microelectronics: Adhesion and Adhesives: Fundamental and Applied Aspects
Autor KL Mittalen Limba Engleză Hardback – 23 oct 2014
Din seria Adhesion and Adhesives: Fundamental and Applied Aspects
- 24% Preț: 1209.15 lei
- 9% Preț: 1311.91 lei
- 9% Preț: 1334.74 lei
- 9% Preț: 1424.81 lei
- 9% Preț: 1310.75 lei
- 33% Preț: 1015.09 lei
- 33% Preț: 1014.55 lei
- 33% Preț: 1007.37 lei
- 32% Preț: 989.97 lei
- 32% Preț: 955.45 lei
- 33% Preț: 1100.90 lei
- 33% Preț: 1103.59 lei
- 32% Preț: 1191.56 lei
- 33% Preț: 1043.51 lei
- 24% Preț: 1082.01 lei
Preț: 984.57 lei
Preț vechi: 1463.22 lei
-33% Nou
Puncte Express: 1477
Preț estimativ în valută:
188.49€ • 195.92$ • 156.28£
188.49€ • 195.92$ • 156.28£
Carte indisponibilă temporar
Doresc să fiu notificat când acest titlu va fi disponibil:
Se trimite...
Preluare comenzi: 021 569.72.76
Specificații
ISBN-13: 9781118831335
ISBN-10: 1118831330
Pagini: 368
Dimensiuni: 163 x 240 x 25 mm
Greutate: 0.64 kg
Editura: Wiley
Seria Adhesion and Adhesives: Fundamental and Applied Aspects
Locul publicării:Hoboken, United States
ISBN-10: 1118831330
Pagini: 368
Dimensiuni: 163 x 240 x 25 mm
Greutate: 0.64 kg
Editura: Wiley
Seria Adhesion and Adhesives: Fundamental and Applied Aspects
Locul publicării:Hoboken, United States
Public țintă
Materials scientists and electronics engineers involved or interested in understanding and achieving the required level of adhesion in the overall microelectronics industry.
0 R&D and manufacturing personnel in other industries,e.g, packaging, thin film technology, metallized plastics, encapsulation, printed circuit boards.
0 Major microelectronics companies, e.g., IBM, Texas Instruments, Motorola, Intel, Hewlett–Packard, Apple.
Cuprins
Descriere
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source.