Adhesive Chemistry: Developments and Trends: Polymer Science and Technology Series, cartea 29
Editat de Lieng-Huang Leeen Limba Engleză Paperback – 30 sep 2011
Din seria Polymer Science and Technology Series
- Preț: 390.94 lei
- Preț: 391.51 lei
- 18% Preț: 1362.42 lei
- Preț: 383.26 lei
- Preț: 395.59 lei
- Preț: 379.51 lei
- Preț: 392.43 lei
- 15% Preț: 647.34 lei
- 18% Preț: 1204.68 lei
- Preț: 376.72 lei
- Preț: 379.14 lei
- Preț: 391.67 lei
- Preț: 382.53 lei
- Preț: 382.53 lei
- Preț: 379.51 lei
- 18% Preț: 1801.88 lei
- Preț: 388.29 lei
- Preț: 389.46 lei
- Preț: 380.27 lei
- Preț: 391.10 lei
- Preț: 392.79 lei
- Preț: 389.98 lei
- 18% Preț: 931.53 lei
- 18% Preț: 931.65 lei
- 18% Preț: 1506.34 lei
- Preț: 373.76 lei
- Preț: 374.65 lei
- Preț: 399.92 lei
- 18% Preț: 924.15 lei
- 15% Preț: 619.34 lei
- Preț: 391.67 lei
- 15% Preț: 690.21 lei
- 15% Preț: 638.09 lei
- 18% Preț: 1202.84 lei
- Preț: 373.76 lei
- Preț: 391.88 lei
- Preț: 384.58 lei
- Preț: 377.30 lei
- Preț: 384.75 lei
Preț: 660.01 lei
Preț vechi: 776.48 lei
-15% Nou
Puncte Express: 990
Preț estimativ în valută:
126.33€ • 131.66$ • 105.16£
126.33€ • 131.66$ • 105.16£
Carte tipărită la comandă
Livrare economică 06-20 ianuarie 25
Preluare comenzi: 021 569.72.76
Specificații
ISBN-13: 9781461294818
ISBN-10: 1461294819
Pagini: 884
Ilustrații: 871 p.
Dimensiuni: 178 x 254 x 46 mm
Greutate: 1.5 kg
Ediția:1984
Editura: Springer Us
Colecția Springer
Seria Polymer Science and Technology Series
Locul publicării:New York, NY, United States
ISBN-10: 1461294819
Pagini: 884
Ilustrații: 871 p.
Dimensiuni: 178 x 254 x 46 mm
Greutate: 1.5 kg
Ediția:1984
Editura: Springer Us
Colecția Springer
Seria Polymer Science and Technology Series
Locul publicării:New York, NY, United States
Public țintă
ResearchCuprins
One: Chemistry of Adhesion — The Importance of Interface.- Introductory Remarks.- Recent Developments in Adhesive and Sealant Chemistry.- Overview of Adherence Phenomena.- An Analytical Method for Determining the Surface Energy of Solid Polymers.- Effect of Amine Surface Treatment on the Adhesion of Polyurethane to the Surface.- Effect of Silane on Glass/Resin Adhesion Strength.- Discussion.- Two: Physics of Adhesion — Characterization of Surface and Bulk of Adhesive Systems.- Introductory Remarks.- New Applications of ESCA.- Fracto-Emission Accompanying Adhesive Failure.- Monitoring Epoxy Cure Kinetics with a Viscosity-Dependent Fluorescent Probe.- Dynamic Mechanical Properties of Silicone Pressure Sensitive Adhesives.- The Viscoelastic Properties of Pressure-Sensitive Adhesives.- Block Copolymer Adhesive Studies.- Discussion.- Three: Radiation-Curable Adhesives.- Introductory Remarks.- Ultraviolet Cured Pressure-Sensitive Adhesives.- Recent Progress in Photoinitiated Cationic Polymerization.- Polymer and Formulation Design Characteristics for Developing Bonding Capabilities of Radiation-Curable Coatings and Adhesive Systems.- Dynamic Thermal Analysis Characterizations of Electron-Beam Cured Adhesives.- Reactive Butadiene/Acrylonitrile Liquid and Solid Elastomers: Formulating Acrylic, Anaerobic, and Radiation-Curable Adhesives.- Photoinitiators: A Review of Mechanisms and Applications.- Discussion.- Four: High Temperature Adhesives.- Introductory Remarks.- Status of High Temperature Adhesives.- Polyimide Adhesives: Modified with ATBN and Silicone Elastomers.- The Application of Thermodynamic and Spectroscopic Techniques to Adhesion in the Polyimide/Ti 6–4 and Polyphenyl-quinoxaline/Ti 6–4 Systems.- Evaluation of High Temperature Structural Adhesives forExtended Service.- Aminosilane and Metal Modifications of Polyimide Surfaces.- Influence of Molecular Weight on Fracture Behavior of Polyphenylquinoxaline Thermosets.- Discussion.- Five: Anaerobic and Structural Adhesives.- Introductory Remarks.- Some Recent Developments in Scanning Electron Microscopy.- Potential Anaerobic and Structural Acrylic Modified Polyester Adhesives.- Anaerobic Adhesives Containing Maleimides Having Improved Thermal Resistance.- Chemistry of Accelerators for Curing Anaerobic Adhesives — Reaction of N,N-Dimethylaniline Derivatives with Cumene Hydroperoxide.- Chemistry, Physical Properties and Durability of Structural Adhesive Bonds.- Reactive Butadiene/Acrylonitrile Liquid and Solid Elastomers: A Bibliography for Formulating Epoxy Structured Adhesives.- A Low Curing Temperature CTBN-Toughened Epoxy Adhesive.- Summarizing Remarks.- Discussion.- Six: Trends in Adhesive Research.- Developments in and Limitations of Adhesive Materials for Severe Environments and a Long Service Life.- Elastomers and Resin Modifiers for Water-Base Adhesives.- “Aerobic” Acrylic Adhesives— New Technology in Acrylic Adhesives.- Radiant Energy Curable Adhesives.- Isocyanatoethyl Methacrylate: A Latent Cross linker for Coating Adhesive Resins.- Moisture Permeation of Polymer Sealants and Interface Modifying Films.- ESCA and AES Studies of the Interfacial Chemical Bonding between Aluminum and Chromium (III) Fumarato-Coordination Compound.- Adhesive Research in China.- Discussion.- Contributors.- Author Index.