Embedded and Fan–Out Wafer and Panel Level Packagi ng Technologies for Advanced Application Spaces – High Performance Compute and System–in–Package IEEE Press Autor B Keser 3 ian 2022 Hardback Preț: 838.44 lei 921.35 lei 6-8 săpt. -9%
Advances in Embedded and Fan–Out Wafer Level Packaging Technologies IEEE Press Autor B Keser 28 mar 2019 Hardback Preț: 853.29 lei 937.68 lei 6-8 săpt. -9%