Demystifying Chipmaking
Autor Richard F. Yanda, Michael Heynes, Anne Milleren Limba Engleză Paperback – 6 ian 2021
The CMOS (Complementary Metal-Oxide-Semiconductor) process flow is the focus of the discussion and is covered in ten chapters. The vast majority of chips made today are fabricated using this general method. In order to ensure that all readers are comfortable with the vocabulary, the first chapter carefully and clearly introduces the science concepts found in later chapters. A chapter is devoted to pointing out the differences in other manufacturing methods, such as the gallium arsenide technology that produces chips for cell phones. In addition, a chapter describing the nature of the semiconductor industry from a business perspective is included.
"The entire process of making a chip is surprisingly easy to understand. The part of the story that defies belief is the tiny dimensions: the conducting wires and other structures on a chip are more than a hundred times thinner than a hair - and getting thinner with every new chip design."
- Authors are actual engineers who have a broad range of exposure and experience with chip technology
- Contains a unique chapter describing the nature of the semiconductor industry from a business perspective
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Specificații
ISBN-13: 9780750677608
ISBN-10: 0750677600
Pagini: 280
Dimensiuni: 191 x 235 x 17 mm
Greutate: 0.68 kg
Editura: ELSEVIER SCIENCE
ISBN-10: 0750677600
Pagini: 280
Dimensiuni: 191 x 235 x 17 mm
Greutate: 0.68 kg
Editura: ELSEVIER SCIENCE
Public țintă
Electronics engineers, engineering managers, and studentsCuprins
1. IC Fabrication Overview
2. Support Technologies
3. Forming Wells
4. Isolate Active Areas (Shallow Trench Isolation)
5. Building the Transistors
6. First Level Metallization
7. Multilevel Metal Interconnects and Dual Damascene
8. Test and Assembly
APPENDIX
A: Science Overview
B: Plasma Etch Supplement to Chapter 4
2. Support Technologies
3. Forming Wells
4. Isolate Active Areas (Shallow Trench Isolation)
5. Building the Transistors
6. First Level Metallization
7. Multilevel Metal Interconnects and Dual Damascene
8. Test and Assembly
APPENDIX
A: Science Overview
B: Plasma Etch Supplement to Chapter 4
Recenzii
"...a useful guide for engineers just entering the packaging sector of the semiconductor industry or for newly vetted engineering school grads." --Ron Iscoff, Editor, Chip Scale Review
"Demystifying Chipmaking...will provide an interesting overview of the IC fabrication process while familiarizing you with the terminology." --Rick Nelson, Chief Editor, Test & Measurement World
"Demystifying Chipmaking...will provide an interesting overview of the IC fabrication process while familiarizing you with the terminology." --Rick Nelson, Chief Editor, Test & Measurement World