Design and Application of Intelligent Thermally Conductive Materials
Autor Wei Fengen Limba Engleză Paperback – 21 mar 2025
For all readers, including researchers, industry professionals, and technicians in the field, chapters on the structure, design, development and performance of intelligent thermal conductive materials provide essential information. While the potential future demand for these materials is enormous, the author indicates where developmental, technical, and production bottlenecks may occur. The possible use of intelligent thermal conductive materials in a wide range of contexts is discussed, together with their potential for energy saving and resource conservation.
- Focuses on the newly evolving field of intelligent thermal conductive materials: a new type of functional materials designed for rapid heat diversion and management that enables autonomous response to the thermal environment using intelligent thermal conductivity control
- Covers a broad range of topics relating to these newly-developed materials: from the structure of the basic materials to the design and application of intelligent materials
- Discusses the application capacity for this type of intelligent or smart material
- Provides updates on potential bottlenecks to the development, design, related technology, and production of these materials
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Specificații
ISBN-13: 9780443404092
ISBN-10: 0443404097
Pagini: 900
Dimensiuni: 152 x 229 mm
Editura: ELSEVIER SCIENCE
ISBN-10: 0443404097
Pagini: 900
Dimensiuni: 152 x 229 mm
Editura: ELSEVIER SCIENCE
Cuprins
1. Overview of thermal conductivity
2. Overview of intelligent thermal conductive materials
3. Design of intelligent performance
4. Design of intelligent thermal conductive materials
5. Application of intelligent thermal conductive materials
6. Application of intelligent thermal conductive materials in advanced chips
7. Conclusions and outlook
2. Overview of intelligent thermal conductive materials
3. Design of intelligent performance
4. Design of intelligent thermal conductive materials
5. Application of intelligent thermal conductive materials
6. Application of intelligent thermal conductive materials in advanced chips
7. Conclusions and outlook