EKC 2019 Conference Proceedings: Science, Technology, and Humanity: Advancement and Sustainability
Editat de Jong Mun Park, Dong Ryeol Whangen Limba Engleză Hardback – 13 noi 2020
The scope is broad, with topics covered including physics and mathematics; chemistry, materials and chemical engineering; biology, bioengineering and medical science; Earth science and environmental engineering; architecture, civil and ocean engineering; electrical, electronic, and informational engineering; mechanical, aerospace, naval, and nuclear engineering; and social science.
This book showcases a selection of peer-reviewed, high-impact research results which will be of interest to a wide audience.
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Specificații
ISBN-13: 9789811583490
ISBN-10: 9811583498
Pagini: 104
Ilustrații: IX, 104 p. 48 illus., 41 illus. in color.
Dimensiuni: 155 x 235 mm
Greutate: 0.45 kg
Ediția:1st ed. 2021
Editura: Springer Nature Singapore
Colecția Springer
Locul publicării:Singapore, Singapore
ISBN-10: 9811583498
Pagini: 104
Ilustrații: IX, 104 p. 48 illus., 41 illus. in color.
Dimensiuni: 155 x 235 mm
Greutate: 0.45 kg
Ediția:1st ed. 2021
Editura: Springer Nature Singapore
Colecția Springer
Locul publicării:Singapore, Singapore
Cuprins
Chapter 1. Novel adamantane asymmetrically substituted diketopyrrolopyrroles (Martin Cigánek, Patricie Heinrichová, Martin Weiter and Jozef Krajčovič).- Chapter 2. Machine Learning Approach on Steel Microstructure Classification (Haon Park and Abdullah Öztürk).- Chapter 3. Metabolomics and its Applications to Personalized Medicine (Lee Sherlock and K. H. Mok).- Chapter 4. Partition-based Task Mapping for Communication Energy Minimization in 3D Network-on-Chip (Sanghoon Kwak).- Chapter 5. Design of Floating Offshore Wind Turbine (FOWT) “SelfAligner (Jens Cruse, Moustafa Abdel-Maksoud, Alexander Düster, Andreas Bockstedte, Gerrit Haake, and Sönke Siegfriedsen).- Chapter 6. Design of Highly Loaded Slewing Bearings - The Collaborative Project HBDV (Jae-Il Hwang, Jan Torben Terwey, Josephine Kelley, Felix Saure, Heinrich Peter Schönemeier, Prof. Dr.-Ing. Gerhard Poll).- Chapter 7. Preliminary Study on Blade Trailing Edge Flap System using Flexible Torsion Bar and Worm Drive (Kwangtae Ha).- Chapter 8. Validation of Real Time Gait Analysis Using a Single Head-Worn IMU (Tong-Hun Hwang, Julia Reh, Alfred O. Effenberg, Holger Blume).- Chapter 9. Three-dimensional visualization of atomic ordering by Bragg ptychograpy (Chan Kim and Anders Madsen).
Notă biografică
Jong Mun Park is a “President of Korean Scientist Association of Austria”, a “Chair of KIAT European Korean Science & Technology Advisory Board”. He was a member of “2015/2016/2017 EU Eurostars2 IEP (Independent Evaluation Panel). He is a Principal Engineer in the R&D Department of ams AG since 2003, and has now about 30 years experiences in semiconductor fields. Jong Mun received his Ph.D. from Vienna University of Technology in 2004. From 1988-2001 he worked as Senior Researcher at the Power Semiconductor Group, Korea Electrotechnology Research Institute (KERI), where he had been leading many national projects for developing high-voltage and power semiconductor devices. Dr. Park holds over 25 national/international patents and co-authored over 120 publications in technical journals and a book. In 2009-2011 he was in the IRPS Technical Committee and co-chair in the high-voltage/RF session. Dr. Park was a member of ESSDERC2015 technical committee. He was also involved as work-package/task leader in several European projects like MODERN and SUPERTHEME. He received a best research awards from Steiermark, Austria at 2011. From 2006-2009 he was a leader of TCAD/Device engineering team within ams/IBM joint project for developing high-voltage IC technology, where he developed the industry best high-voltage p-channel LDMOS transistors. His interests include device engineering/optimization/TCAD works for high-voltage CMOS, nano-metal filter and CMOS integration, hot-carrier reliability, SiC power devices, high-voltage CMOS integration, industry & medical sensors, sensors for wearable devices, medical/iTOF CMOS image sensors, optics & photodiode integration, and 3D sensor integration.
Textul de pe ultima copertă
This volume offers a selection of papers presented at the Europe-Korea Conference on Science and Technology 2019 (EKC 2019). EKC is a multi/inter/transdisciplinary conference covering all fields of science and technology, aiming to facilitate networking and collaboration between academic and industrial researchers involved in R&D, engineering, manufacturing, and application.
The scope is broad, with topics covered including physics and mathematics; chemistry, materials and chemical engineering; biology, bioengineering and medical science; Earth science and environmental engineering; architecture, civil and ocean engineering; electrical, electronic, and informational engineering; mechanical, aerospace, naval, and nuclear engineering; and social science.
This book showcases a selection of peer-reviewed, high-impact research results which will be of interest to a wide audience.
The scope is broad, with topics covered including physics and mathematics; chemistry, materials and chemical engineering; biology, bioengineering and medical science; Earth science and environmental engineering; architecture, civil and ocean engineering; electrical, electronic, and informational engineering; mechanical, aerospace, naval, and nuclear engineering; and social science.
This book showcases a selection of peer-reviewed, high-impact research results which will be of interest to a wide audience.