Cantitate/Preț
Produs

Electronic Engineering: Proceedings of the 4th International Conference of Electronic Engineering and Information Science (ICEEIS 2017), January 7-8, 2017, Haikou, P.R. China

Editat de Dongxing Wang
en Limba Engleză Hardback – 31 iul 2018
The 4th International Conference of Electronic Engineering and Information Science 2017 (ICEEIS2017) was held January 7-8, 2017 in Haikou, P.R. China. This conference was sponsored by the Harbin University of Science and Technology, China. The conference continued the tradition of gathering world-class researchers, engineers and educators engaged in the fields of electronic engineering and information science to meet and present their latest activities. The proceedings contains contributions in the fields of Electronic Engineering, Information Science and Information Technologies, Computational Mathematics and Data Mining, Mechatronics, Control and Automation and Material Science and Technologies of Processing.
Citește tot Restrânge

Preț: 109894 lei

Preț vechi: 148101 lei
-26% Nou

Puncte Express: 1648

Preț estimativ în valută:
21031 21846$ 17470£

Carte tipărită la comandă

Livrare economică 03-17 februarie 25

Preluare comenzi: 021 569.72.76

Specificații

ISBN-13: 9781138602601
ISBN-10: 1138602604
Pagini: 266
Dimensiuni: 174 x 246 x 23 mm
Greutate: 0.59 kg
Ediția:1
Editura: CRC Press
Colecția CRC Press

Public țintă

Postgraduate and Professional

Cuprins

Preface. Papers. Author index.

Notă biografică

Dongxing Wang received a Bachelor of Science degree and Master of Science degree from the Harbin University of Science and Technology, and a Ph.D. degree from Chiba University in 1984, 1990, and 1999 respectively. His current research interests include organic semiconductor devices and semiconductor process. Dongxing Wang is currently professor at the Harbin University of Science and Technology.

Descriere

ICEEIS 2017 continued the excellent tradition of gathering world-class researchers, engineers and educators engaged in the fields of electronic engineering and information science to meet and present their latest activities.