Electronic Packaging Materials and Their Properties: Electronic Packaging
Autor Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajanen Limba Engleză Hardback – 18 dec 1998
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:
Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
Preț: 1106.02 lei
Preț vechi: 1348.80 lei
-18% Nou
Puncte Express: 1659
Preț estimativ în valută:
211.66€ • 219.64$ • 176.91£
211.66€ • 219.64$ • 176.91£
Carte tipărită la comandă
Livrare economică 17-31 martie
Preluare comenzi: 021 569.72.76
Specificații
ISBN-13: 9780849396250
ISBN-10: 0849396255
Pagini: 120
Ilustrații: 61 Tables, black and white
Dimensiuni: 156 x 234 x 12 mm
Greutate: 0.36 kg
Ediția:1
Editura: CRC Press
Colecția CRC Press
Seria Electronic Packaging
ISBN-10: 0849396255
Pagini: 120
Ilustrații: 61 Tables, black and white
Dimensiuni: 156 x 234 x 12 mm
Greutate: 0.36 kg
Ediția:1
Editura: CRC Press
Colecția CRC Press
Seria Electronic Packaging
Public țintă
ProfessionalNotă biografică
Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan
Cuprins
Introduction,Properties of Electronics Packaging Materials,Electrical Properties,Thermal and Thermomechanical Properties,Mechanical Properties,Chemical Properties,Miscellaneous Properties,Zeroth-Level Packaging Materials,Semiconductors,Attachment Materials,Substrates,First-Level Packaging Materials,Wire Interconnects,Tape Interconnects,Case Materials,Lid Seals,Leads,Second-Level Packaging Materials,Reinforcement Fiber Materials,Resins,Laminates,Constraining Cores,Flexible Wiring Board Materials,Conductor Metals in Laminates,Conformal Coatings,Third-Level Packaging Materials,Backpanel Materials,Connectors Materials,Cables and Flex Circuit Materials,Summary,Appendices,Index
Descriere
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. Electronic Packaging: Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders. The book also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.