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Electronic Packaging Materials and Their Properties de Michael Pecht

Electronic Packaging Materials and Their Properties: Electronic Packaging

Autor Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan
en Limba Engleză Hardback – 18 dec 1998
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:
  • interconnections
  • printed circuit boards
  • substrates
  • encapsulants
  • dielectrics
  • die attach materials
  • electrical contacts
  • thermal materials
  • solders
    Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
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    Specificații

    ISBN-13: 9780849396250
    ISBN-10: 0849396255
    Pagini: 120
    Ilustrații: 61 Tables, black and white
    Dimensiuni: 156 x 234 x 12 mm
    Greutate: 0.36 kg
    Ediția:1
    Editura: CRC Press
    Colecția CRC Press
    Seria Electronic Packaging

    Public țintă

    Professional

    Notă biografică

    Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan

    Cuprins

    Introduction,Properties of Electronics Packaging Materials,Electrical Properties,Thermal and Thermomechanical Properties,Mechanical Properties,Chemical Properties,Miscellaneous Properties,Zeroth-Level Packaging Materials,Semiconductors,Attachment Materials,Substrates,First-Level Packaging Materials,Wire Interconnects,Tape Interconnects,Case Materials,Lid Seals,Leads,Second-Level Packaging Materials,Reinforcement Fiber Materials,Resins,Laminates,Constraining Cores,Flexible Wiring Board Materials,Conductor Metals in Laminates,Conformal Coatings,Third-Level Packaging Materials,Backpanel Materials,Connectors Materials,Cables and Flex Circuit Materials,Summary,Appendices,Index

    Descriere

    Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. Electronic Packaging: Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders. The book also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.