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Electronics Reliability and Measurement Technology: Nondestructive Evaluation de Joseph S. Heyman

Electronics Reliability and Measurement Technology: Nondestructive Evaluation

Autor Joseph S. Heyman
en Limba Engleză Hardback – 30 dec 1998
This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.
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Specificații

ISBN-13: 9780815511717
ISBN-10: 081551171X
Pagini: 140
Dimensiuni: 152 x 229 x 10 mm
Greutate: 0.47 kg
Editura: ELSEVIER SCIENCE

Public țintă

Quality assurance managers and reliability engineers in the electronics industry.

Cuprins

Measurement Science and Manufacturing Science ResearchNondestructive SEM for Surface and Subsurface Wafer ImagingSurface Inspection-Research and DevelopmentWafer Level Reliability for High-Performance VLSI DesignWafer Level Reliability Testing: an Idea Whose Time Has ComeMicro-Focus X-Ray ImagingMeasurement of Opaque Film ThicknessIntelligent Laser Soldering Inspection and Process ControlRupture Testing for the Quality Control of Electrodeposited Copper Interconnections in High-Speed, High-Density CircuitsHeterodyne Holographic Interferometry: High-Resolution Ranging and Displacement Measurement""Whole Wafer"" Scanning Electron Microscopy