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Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques (a 6-Volume Set): Encyclopedia Of Thermal Packaging

Editat de Avram Bar-Cohen
en Limba Engleză Hardback – 27 sep 2012
Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density. This title provides comprehensive treatment of the techniques, configurations, tools and applications of electronic thermal packaging.
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Specificații

ISBN-13: 9789814313780
ISBN-10: 9814313785
Pagini: 1580
Dimensiuni: 178 x 257 x 130 mm
Greutate: 4.04 kg
Editura: WORLD SCIENTIFIC
Seria Encyclopedia Of Thermal Packaging


Cuprins

Volume 1: Microchannel Heat Sinks for Electronics Cooling (Suresh V Garimella & Tannaz Harirchian [Purdue University, USA]); Volume 2: Air- and Liquid-Cooled Cold Plates (Allan Kraus [Kraus Associates, USA]); Volume 3: Dielectric Liquid Cooling of Immersed Components (Karl J L Geisler [3M, USA] & Avram Bar-Cohen [University of Maryland, USA]); Volume 4: Thermoelectric Microcoolers (Bao Yang & Peng Wang [University of Maryland, USA]); Volume 5: Energy Efficient Solid State Lighting (Mehmet Arik [Ozyegin University, Turkey], Anant Setlur, Stanton E Weaver, Jr. & Joseph J Shiang [General Electric, USA]); Volume 6: Experimental Thermofluid Characterization of Electronic Components (Gary L Solbrekken [University of Missouri at Columbia, USA]).