Handbook of Materials Failure Analysis: With Case Studies from the Electronic and Textile Industries
Editat de Abdel Salam Hamdy Makhlouf, Mahmood Aliofkhazraeien Limba Engleză Hardback – 25 oct 2019
- Provides the most up-to-date and balanced coverage of failure analysis, combining foundational knowledge and current research on the latest developments and innovations in the field
- Offers an ideal accompaniment for those interested in materials forensic investigation, failure of materials, static failure analysis, dynamic failure analysis, and fatigue life prediction
- Presents compelling new case studies from key industries to demonstrate concepts
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Specificații
ISBN-13: 9780081019375
ISBN-10: 0081019378
Pagini: 384
Dimensiuni: 191 x 235 x 27 mm
Greutate: 0.88 kg
Editura: ELSEVIER SCIENCE
ISBN-10: 0081019378
Pagini: 384
Dimensiuni: 191 x 235 x 27 mm
Greutate: 0.88 kg
Editura: ELSEVIER SCIENCE
Public țintă
Materials engineers, chemists, and research scientists working in materials engineering and failure analysis primarily in the electronics industryCuprins
Part 1: Electronics Industries
1. Failures of Electronic Devices: Solder Joints Failure Modes, Causes and Detection Method
2. Electron-beam Radiation Damage and the Technical Solutions for Materials Failure Analysis of Electron-beam Sensitive Materials in Modern Semiconductor Industry
3. Failure of intermetallic solder ball due to stress shielding and amplification effects
4. Assessment of the indoor corrosion in consumer electronics in subtropical climates.
5. Pb-free Solder – Microstructural, Material Reliability and Failure Relationships
6. The Role of Contamination in Failures of Electronics – Case Studies
7. Reliability analysis of vibrating electronic assemblies using analytical solutions and response surface methodology
8. Stress Analysis of Stretchable Conductive Polymer for Electronics Circuit Application
9. New methodology for qualification and lifetime assessment of electronic systems
Part 2: Textiles Industries
10. Textile Failure Analysis and Mechanical Behavior Characterization by using Acoustic Emission Technique
11. Failure of yarns in different textile applications
12. Treatment effect on failure mode of industrial carbon textile at elevated temperature
1. Failures of Electronic Devices: Solder Joints Failure Modes, Causes and Detection Method
2. Electron-beam Radiation Damage and the Technical Solutions for Materials Failure Analysis of Electron-beam Sensitive Materials in Modern Semiconductor Industry
3. Failure of intermetallic solder ball due to stress shielding and amplification effects
4. Assessment of the indoor corrosion in consumer electronics in subtropical climates.
5. Pb-free Solder – Microstructural, Material Reliability and Failure Relationships
6. The Role of Contamination in Failures of Electronics – Case Studies
7. Reliability analysis of vibrating electronic assemblies using analytical solutions and response surface methodology
8. Stress Analysis of Stretchable Conductive Polymer for Electronics Circuit Application
9. New methodology for qualification and lifetime assessment of electronic systems
Part 2: Textiles Industries
10. Textile Failure Analysis and Mechanical Behavior Characterization by using Acoustic Emission Technique
11. Failure of yarns in different textile applications
12. Treatment effect on failure mode of industrial carbon textile at elevated temperature