Handbook of Printed Circuit Manufacturing
Autor Raymond H. Clarken Limba Engleză Paperback – 25 feb 2012
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Specificații
ISBN-13: 9789401170147
ISBN-10: 9401170142
Pagini: 644
Ilustrații: XIX, 620 p.
Dimensiuni: 152 x 229 x 34 mm
Greutate: 0.85 kg
Ediția:Softcover reprint of the original 1st ed. 1985
Editura: SPRINGER NETHERLANDS
Colecția Springer
Locul publicării:Dordrecht, Netherlands
ISBN-10: 9401170142
Pagini: 644
Ilustrații: XIX, 620 p.
Dimensiuni: 152 x 229 x 34 mm
Greutate: 0.85 kg
Ediția:Softcover reprint of the original 1st ed. 1985
Editura: SPRINGER NETHERLANDS
Colecția Springer
Locul publicării:Dordrecht, Netherlands
Public țintă
ResearchCuprins
Section 1. Design and Manufacture of Printed Circuits.- 1. How Printed Circuit Boards Are Manufactured: Processes and Materials.- 2. Computer Aided Design and Design Automation.- 3. Digital Printed Circuit Design.- Section 2. Planning, Document Control, and Quality.- 4. Definitions.- 5. Planning.- 6. Quality Assurance Program.- 7. Quality Assurance Manual.- Section 3. Imaging and Artwork.- 8. Artwork Processing.- 9. Artwork Registration Systems for Dry Film Imaging.- 10. Dry Film Imaging.- 11. Screen Printing.- Section 4. N/C Processing.- 12. Numerical Controlled Drilling and Routing.- 12A. Drilling Procedures.- Section 5. Plating and Other Wet Processes.- 13. Metal Thickness Determination.- 14. Amperage Determination.- 15. The Electroless Copper Process 300 Detecting Problems.- 16. Pattern Plating: Copper, Tin-Lead, and Other Metals.- 17. Contact Finger Plating.- 18. Resist Stripping.- 19. Etching.- 20. Tin-Lead Fusing.- Section 6. Multilayer Printed Circuits.- 21. Multilayer Processing.- 22. Etchback and Smear Removal.- Section 7. Process Control.- 23. The Laboratory.- Section 8. The Marketing Program.- 24. Sales Tools.- 25. What Sales People Should Know About Printed Circuits.- Appendix A: Yield Tracking: A Tool for Productivity.- Appendix B: CAD: Swift, Precise, Infinitely Repeatable, but Never Creative.- Appendix C: Soldermask Over Bare Copper: Alternatives and Manufacturing Techniques.- Appendix D: Control and Operation of Printed Circuit Plating Baths with the Hull Cell.- Appendix E: Troubleshooting the IR Fusing Process.- Appendix F: Preserving Solderability with Solder Coatings.- Appendix G: Screen Printing Is the Answer.- Appendix H: Forecasting Waste Treatment Requirements.- Appendix I: Wave Soldering of Discrete Chip Components.