In-Circuit Testing
Autor John T. Batesonen Limba Engleză Paperback – 20 mar 2012
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Specificații
ISBN-13: 9789401170116
ISBN-10: 9401170118
Pagini: 268
Ilustrații: XX, 244 p.
Dimensiuni: 152 x 229 x 14 mm
Greutate: 0.36 kg
Ediția:Softcover reprint of the original 1st ed. 1985
Editura: SPRINGER NETHERLANDS
Colecția Springer
Locul publicării:Dordrecht, Netherlands
ISBN-10: 9401170118
Pagini: 268
Ilustrații: XX, 244 p.
Dimensiuni: 152 x 229 x 14 mm
Greutate: 0.36 kg
Ediția:Softcover reprint of the original 1st ed. 1985
Editura: SPRINGER NETHERLANDS
Colecția Springer
Locul publicării:Dordrecht, Netherlands
Public țintă
ResearchCuprins
1. Understanding the Production Fault Sources.- 1.1. Component Fault Sources.- 1.2. Manufacturing Fault Sources.- 1.3. Performance Fault Sources.- 1.4. Manufacturability.- 1.5. PCB Fault Spectrum.- 1.6. Defective PCB Investigation.- 1.7. Future Fault Distribution.- 2. Automatic Test Equipment for Production Test.- 2.1. In-House Test Systems.- 2.2. Commercial Testers.- 2.3. Loaded-Board Testing Trends.- 2.4. Tester’s Fault Coverage.- 2.5. Fault Coverage and Test Programming.- 2.6. Test Diagnostics.- 2.7. Unverifiable Faults.- 2.8. Failures at System Test.- 2.9. Cost of Testing.- 3. Production PCB Test System Comparison.- 3.1. In-Circuit and Functional Board Tester Comparison.- 3.2. In Circuit and Functional Board Tester Summary.- 3.3. Comparison of In-Circuit Tester, In-Circuit Analyzer, and Loaded-Board Shorts Tester.- 3.4. In-Circuit Tester, In-Circuit Analyzer, and Loaded-Board Shorts Tester Summary.- 3.5. Low-Cost ATE.- 4. PCB Production Test Strategies.- 4.1. Test Strategies.- 4.2. Medium-Volume Test Strategy.- 4.3. High-Volume Test Strategy.- 4.4. PCB Test Strategy Evaluation.- 5. The Rework Station and Networking.- 5.1. The Rework Station.- 5.2. Rework Effectiveness.- 5.3. Paperless Repair System.- 5.4. Computer-Aided Repair.- 5.5. Networking.- 5.6. Test Area Management System.- 6. In-Circuit Testing Philosophy.- 6.1. UUT Fixture Verification.- 6.2. Shorts Opens Test.- 6.3. Analog Measurement.- 6.4. Analog Testing.- 6.5. Operational Amplifiers.- 6.6. Analog Testing Summary.- 6.7. Device Orientation.- 6.8. Digital Testing.- 6.9. Test Program Preparation.- 6.10. IEEE-488 Instrumentation.- 7. In-Circuit Tester.- 7.1. Computer Subsystem.- 7.2. Switching and Measurement Subsystem.- 7.3. UUT Interface Subsystem.- 7.4. Generic In-Circuit Tester.- 7.5. OperatingSoftware.- 7.6. Test Executive.- 7.7. Test Programming.- 7.8. Test Programming Station.- 7.9. Bare-Board Shorts and Continuity Tester.- 7.10. Test Fixture Systems.- 7.11. PCB Layout Guidelines for Testability.- 8. In-Circuit Testers for Service and Repair.- 8.1. Service Repair Strategies.- 8.2. Service Problems.- 8.3. Board Float.- 8.4. Board Mix.- 8.5. Fault Spectrum.- 8.6. PCB Population.- 8.7. Test Requirements.- 8.8. Capital Expenditure.- 8.9. Service ATE Requirements.- 8.10. Functional and In-Circuit Comparison.- 8.11. Functional and In-Circuit Summary.- 8.12. Generic Service In-Circuit Tester.- 9. In-Circuit Tester Evaluation.- 9.1. Preparation for Vendor Investigation.- 9.2. Company Evaluation.- 9.3. Test Program Software.- 9.4. Operating System Software.- 9.5. Test System Hardware.- 9.6. Vendor Support.- 9.7. Ratio Evaluation.- 10. Financial Justification.- 10.1. Production In-Circuit Tester.- 10.2. Service In-Circuit Tester.- References.