Information Science and Electronic Engineering: Proceedings of the 3rd International Conference of Electronic Engineering and Information Science (ICEEIS 2016), January 4-5, 2016, Harbin, China
Editat de Dongxing Wangen Limba Engleză Hardback – 6 dec 2016
The papers in this proceedings volume cover various topics, including:
- Electronic Engineering
- Information Science and Information Technologies
- Computational Mathematics and Data Mining
- Image Processing and Computer Vision
- Communication and Signal Processing
- Control and Automation of Mechatronics
- Methods, Devices and Systems for Measurement and Monitoring
- Engineering of Weapon Systems
- Mechanical Engineering and Material Science
- Technologies of Processing.
The content of this proceedings volume will be of interest to professionals and academics in the fields of Electronic Engineering, Computer Science and Mechanical Engineering.
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Specificații
ISBN-13: 9781138029873
ISBN-10: 1138029874
Pagini: 476
Dimensiuni: 174 x 246 mm
Greutate: 0.93 kg
Ediția:1
Editura: CRC Press
Colecția CRC Press
ISBN-10: 1138029874
Pagini: 476
Dimensiuni: 174 x 246 mm
Greutate: 0.93 kg
Ediția:1
Editura: CRC Press
Colecția CRC Press
Public țintă
Postgraduate and ProfessionalCuprins
Preface, Committees, Photocurrent characteristics of organic dye copper phthalocyanine transistors, Current transport mechanism analysis of organic dye copper phthalocyanine thin film transistors, Design of a fast transient response output-capacitorless LDO, Designing a 12 bit pipeline ADC based on the CMOS process, Photoelectric properties of organic pigment zinc phthalocyanine Schottky diodes, On two practical student-oriented auxiliary devices for learner autonomy in English, Digital decimation filter design for Sigma-Delta ADC, Research on the thermal stability and mechanism of PI/TiO2 nanocomposite film, A fault-tolerant routing algorithm for NoC based on 2D Mesh, 20nm and beyond physical design implementation take PR changes, Research on intelligent control system of greenhouse planting, Mechanical properties and toughening mechanism of Csf/SiC ceramic composites, Establishment of the IOV technology innovation alliances and its influencing factors, Geometry modeling program implementation of virtual surgery systems, The analysis of Gd/Sm–Mn substitution on the phase composition of strontium ferrite, Fabrication and characteristics analysis of a ZnO thin film transistor, A modified non-maximum suppression algorithm, A modified measure for image quality analysis, Combination collaborative filtering recommendation algorithm, Modeling and simulation of extended counting ADC, Numerical simulations for near-field acoustic holographic data extrapolation based on the neural network ELM method, Research on high quality intelligent test paper generation based on a genetic algorithm, Self-tuning descriptor Kalman filter with correlated noise, An approach based on support vector regression for single-image super-resolution, Hand-vein image enhancement based on gradient domain, Hand vein recognition based on reference point and NMI, Trade-off performance analysis for SED scheduling in cognitive radios, A selective diversity cooperative spectrum-sensing algorithm for cognitive radios, An improved image super-resolution reconstruction algorithm based on centralised sparse representation, The research and implementation of impact point testing based on acoustic target sensors, Modelling and simulation of vehicle behaviours based on the social force model, Phase locked loop based on reference current under unbalanced and distorted grid, Symbol synchronisation algorithm for ZP-OFDM systems based on spectral entropy, A property of minimal zero-sum sequences of 2n-1elements in C[sub(n)] (Omitted) C[sub(n)], Performance of particle filtering algorithm employed in dynamic cooperative positioning system, Effects and countermeasures of network environment on the cultivation of college students,
Descriere
The 3rd International Conference of Electronic Engineering and Information Science (ICEEIS2016) was held January 4-5, 2016 in Harbin, P.R. China. This conference is sponsored by Harbin University of Science and Technology. The topics covered at ICEEIS2016 include semiconductor materials, nano materials, mechanical materials, MEMS materials, electronic engineering, and information science.