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Low-K Nanoporous Interdielectrics: Materials, Thin Film Fabrications, Structures and Properties

Autor Moonhor Ree
en Limba Engleză Paperback – 30 sep 2010
The use of low dielectric constant (low-k) interdielectrics in multilevel structure integrated circuits (ICs) can lower line-to-line noise in interconnects and alleviate power dissipation issues by reducing the capacitance between the interconnect conductor lines. Because of these merits, low-k interdielectric materials are currently in high demand in the development of advanced ICs. One important approach to obtaining low-k values is the incorporation of nanopores into dielectrics. This book provides an overview of the methodologies and characterisation techniques used for investigating low-k nanoporous interdielectrics.
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Specificații

ISBN-13: 9781616687496
ISBN-10: 1616687495
Pagini: 67
Ilustrații: diagrams & graphs
Dimensiuni: 150 x 226 x 5 mm
Greutate: 0.14 kg
Ediția:New.
Editura: NOVA SCIENCE PUB INC

Cuprins

Introduction; Recent Developments in Low-K Nanoporous Dielectrics; Characterization of Pore Structures; Conclusions; Index.