Modern Semiconductor Devices for Integrated Circuits
Autor Chenming Calvin Huen Limba Engleză Hardback – 28 feb 2009
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Specificații
ISBN-13: 9780136085256
ISBN-10: 0136085253
Pagini: 351
Dimensiuni: 178 x 234 x 20 mm
Greutate: 0.68 kg
Ediția:1
Editura: Prentice Hall
Locul publicării:Upper Saddle River, United States
ISBN-10: 0136085253
Pagini: 351
Dimensiuni: 178 x 234 x 20 mm
Greutate: 0.68 kg
Ediția:1
Editura: Prentice Hall
Locul publicării:Upper Saddle River, United States
Descriere
For courses in semiconductor devices.
Prepare your students for the semiconductor device technologies of today and tomorrow.
Modern Semiconductor Devices for Integrated Circuits, First Edition introduces students to the world of modern semiconductor devices with an emphasis on integrated circuit applications. Written by an experienced teacher, researcher, and expert in industry practices, this succinct and forward-looking text is appropriate for both undergraduate and graduate students, and serves as a suitable reference text for practicing engineers.
Prepare your students for the semiconductor device technologies of today and tomorrow.
Modern Semiconductor Devices for Integrated Circuits, First Edition introduces students to the world of modern semiconductor devices with an emphasis on integrated circuit applications. Written by an experienced teacher, researcher, and expert in industry practices, this succinct and forward-looking text is appropriate for both undergraduate and graduate students, and serves as a suitable reference text for practicing engineers.
Cuprins
1
Electrons and Holes in Semiconductors 1
1.1 Silicon Crystal Structure 1
1.2 Bond Model of Electrons and Holes 4
1.3 Energy Band Model 8
1.4 Semiconductors, Insulators, and Conductors 11
1.5 Electrons and Holes 12
1.6 Density of States 15
1.7 Thermal Equilibrium and the Fermi Function 16
1.8 Electron and Hole Concentrations 19
1.9 General Theory of n and p 25
1.10 Carrier Concentrations at Extremely High and Low Temperatures 28
1.11 Chapter Summary 29
PROBLEMS 30
REFERENCES 33
GENERAL REFERENCES 34
2
Motion and Recombination of Electrons and Holes 35
2.1 Thermal Motion 35
2.2 Drift 38
2.3 Diffusion Current 46
2.4 Relation Between the Energy Diagram and V, _ 47
2.5 Einstein Relationship Between D and µ 48
2.6 Electron—Hole Recombination 50
2.7 Thermal Generation 52
2.8 Quasi-Equilibrium and Quasi-Fermi Levels 52
2.9 Chapter Summary 54
PROBLEMS 56
REFERENCES 58
GENERAL REFERENCES 58
3
Device Fabrication Technology 59
3.1 Introduction to Device Fabrication 60
3.2 Oxidation of Silicon 61
3.3 Lithography 64
3.4 Pattern Transfer–Etching 68
3.5 Doping 70
3.6 Dopant Diffusion 73
3.7 Thin-Film Deposition 75
3.8 Interconnect–The Back-End Process 80
3.9 Testing, Assembly, and Qualification 82
3.10 Chapter Summary–A Device Fabrication Example 83
PROBLEMS 85
REFERENCES 87
GENERAL REFERENCES 88
4
PN and Metal—Semiconductor Junctions 89
Part I: PN Junction 89
4.1 Building Blocks of the PN Junction Theory 90
4.2 Depletion-Layer Model 94
4.3 Reverse-Biased PN Junction 97
4.4 Capacitance-Voltage Characteristics 98
4.5 Junction Breakdown 100
4.6 Carrier Injection Under Forward Bias–Quasi-Equilibrium Boundary Condition 105
4.7 Current Continuity Equation 107
4.8 Excess Carriers in Forward-Biased PN Junction 109
4.9 PN Diode IV Characteristics 112
4.10 Charge Storage 115
4.11 Small-Signal Model of the Diode 116
Part II: Application to Optoelectronic Devices 117
4.12 Solar Cells 117
4.13 Light-Emitting Diodes and Solid-State Lighting 124
4.14 Diode Lasers 128
4.15 Photodiodes 133
Part III: Metal—Semiconductor Junction 133
4.16 Schottky Barriers 133
4.17 Thermionic Emission Theory 137
4.18 Schottky Diodes 138
4.19 Applications of Schottky Diodes 140
4.20 Quantum Mechanical Tunneling 141
4.21 Ohmic Contacts 142
4.22 Chapter Summary 145
PROBLEMS 148
REFERENCES 156
GENERAL REFERENCES 156
5
MOS Capacitor 157
5.1 Flat-Band Condition and Flat-Band Voltage 158
5.2 Surface Accumulation 160
5.3 Surface Depletion 161
5.4 Threshold Condition and Threshold Voltage 162
5.5 Strong Inversion Beyond Threshold 164
5.6 MOS C—V Characteristics 168
5.7 Oxide Charge–A Modification to Vfb and Vt 172
5.8 Poly-Si Gate Depletion–Effective Increase in Tox 174
5.9 Inversion and Accumulation Charge-Layer Thicknesses
–Quantum Mechanical Effect 176
5.10 CCD Imager and CMOS Imager 179
5.11 Chapter Summary 184
PROBLEMS 186
REFERENCES 193
GENERAL REFERENCES 193
6
MOS Transistor 195
6.1 Introduction to the MOSFET 195
6.2 Complementary MOS (CMOS) Technology 198
6.3 Surface Mobilities and High-Mobility FETs 200
6.4 MOSFET Vt, Body Effect, and Steep Retrograde Doping 207
6.5 QINV in MOSFET 209
6.6 Basic MOSFET IV Model 210
6.7 CMOS Inverter–A Circuit Example 214
6.8 Velocity Saturation 219
6.9 MOSFET IV Model with Velocity Saturation 220
6.10 Parasitic Source-Drain Resistance 225
6.11 Extraction of the Series Resistance and the Effective Channel Length 226
6.12 Velocity Overshoot and Source Velocity Limit 228
6.13 Output Conductance 229
6.14 High-Frequency Performance 230
6.15 MOSFET Noises 232
6.16 SRAM, DRAM, Nonvolatile (Flash) Memory Devices 238
6.17 Chapter Summary 245
PROBLEMS 247
REFERENCES 256
GENERAL REFERENCES 257
7
MOSFETs in ICs–Scaling, Leakage, and Other Topics 259
7.1 Technology Scaling–For Cost, Speed, and Power Consumption 259
7.2 Subthreshold Current–“Off” Is Not Totally “Off” 263
7.3 Vt Roll-Off–Short-Channel MOSFETs Leak More 266
7.4 Reducing Gate-Insulator Electrical Thickness and Tunneling Leakage 270
7.5 How to Reduce Wdep 272
7.6 Shallow Junction and Metal Source/Drain MOSFET 274
7.7 Trade-Off Between Ion and Ioff and Design for Manufacturing 276
7.8 Ultra-Thin-Body SOI and Multigate MOSFETs 277
7.9 Output Conductance 282
7.10 Device and Process Simulation 283
7.11 MOSFET Compact Model for Circuit Simulation 284
7.12 Chapter Summary 285
PROBLEMS 286
REFERENCES 288
GENERAL REFERENCES 289
8
Bipolar Transistor 291
8.1 Introduction to the BJT 291
8.2 Collector Current 293
8.3 Base Current 297
8.4 Current Gain 298
8.5 Base-Width Modulation by Collector Voltage 302
8.6 Ebers—Moll Model 304
8.7 Transit Time and Charge Storage 306
8.8 Small-Signal Model 310
8.9 Cutoff Frequency 312
8.10 Charge Control Model 314
8.11 Model for Large-Signal Circuit Simulation 316
8.12 Chapter Summary 318
PROBLEMS 319
REFERENCES 323
GENERAL REFERENCES 323
Appendix I
Derivation of the Density of States 325
Appendix II
Derivation of the Fermi—Dirac Distribution Function 329
Appendix III
Self-Consistencies of Minority Carrier Assumptions 333
Answers to Selected Problems 337
Index 341
Electrons and Holes in Semiconductors 1
1.1 Silicon Crystal Structure 1
1.2 Bond Model of Electrons and Holes 4
1.3 Energy Band Model 8
1.4 Semiconductors, Insulators, and Conductors 11
1.5 Electrons and Holes 12
1.6 Density of States 15
1.7 Thermal Equilibrium and the Fermi Function 16
1.8 Electron and Hole Concentrations 19
1.9 General Theory of n and p 25
1.10 Carrier Concentrations at Extremely High and Low Temperatures 28
1.11 Chapter Summary 29
PROBLEMS 30
REFERENCES 33
GENERAL REFERENCES 34
2
Motion and Recombination of Electrons and Holes 35
2.1 Thermal Motion 35
2.2 Drift 38
2.3 Diffusion Current 46
2.4 Relation Between the Energy Diagram and V, _ 47
2.5 Einstein Relationship Between D and µ 48
2.6 Electron—Hole Recombination 50
2.7 Thermal Generation 52
2.8 Quasi-Equilibrium and Quasi-Fermi Levels 52
2.9 Chapter Summary 54
PROBLEMS 56
REFERENCES 58
GENERAL REFERENCES 58
3
Device Fabrication Technology 59
3.1 Introduction to Device Fabrication 60
3.2 Oxidation of Silicon 61
3.3 Lithography 64
3.4 Pattern Transfer–Etching 68
3.5 Doping 70
3.6 Dopant Diffusion 73
3.7 Thin-Film Deposition 75
3.8 Interconnect–The Back-End Process 80
3.9 Testing, Assembly, and Qualification 82
3.10 Chapter Summary–A Device Fabrication Example 83
PROBLEMS 85
REFERENCES 87
GENERAL REFERENCES 88
4
PN and Metal—Semiconductor Junctions 89
Part I: PN Junction 89
4.1 Building Blocks of the PN Junction Theory 90
4.2 Depletion-Layer Model 94
4.3 Reverse-Biased PN Junction 97
4.4 Capacitance-Voltage Characteristics 98
4.5 Junction Breakdown 100
4.6 Carrier Injection Under Forward Bias–Quasi-Equilibrium Boundary Condition 105
4.7 Current Continuity Equation 107
4.8 Excess Carriers in Forward-Biased PN Junction 109
4.9 PN Diode IV Characteristics 112
4.10 Charge Storage 115
4.11 Small-Signal Model of the Diode 116
Part II: Application to Optoelectronic Devices 117
4.12 Solar Cells 117
4.13 Light-Emitting Diodes and Solid-State Lighting 124
4.14 Diode Lasers 128
4.15 Photodiodes 133
Part III: Metal—Semiconductor Junction 133
4.16 Schottky Barriers 133
4.17 Thermionic Emission Theory 137
4.18 Schottky Diodes 138
4.19 Applications of Schottky Diodes 140
4.20 Quantum Mechanical Tunneling 141
4.21 Ohmic Contacts 142
4.22 Chapter Summary 145
PROBLEMS 148
REFERENCES 156
GENERAL REFERENCES 156
5
MOS Capacitor 157
5.1 Flat-Band Condition and Flat-Band Voltage 158
5.2 Surface Accumulation 160
5.3 Surface Depletion 161
5.4 Threshold Condition and Threshold Voltage 162
5.5 Strong Inversion Beyond Threshold 164
5.6 MOS C—V Characteristics 168
5.7 Oxide Charge–A Modification to Vfb and Vt 172
5.8 Poly-Si Gate Depletion–Effective Increase in Tox 174
5.9 Inversion and Accumulation Charge-Layer Thicknesses
–Quantum Mechanical Effect 176
5.10 CCD Imager and CMOS Imager 179
5.11 Chapter Summary 184
PROBLEMS 186
REFERENCES 193
GENERAL REFERENCES 193
6
MOS Transistor 195
6.1 Introduction to the MOSFET 195
6.2 Complementary MOS (CMOS) Technology 198
6.3 Surface Mobilities and High-Mobility FETs 200
6.4 MOSFET Vt, Body Effect, and Steep Retrograde Doping 207
6.5 QINV in MOSFET 209
6.6 Basic MOSFET IV Model 210
6.7 CMOS Inverter–A Circuit Example 214
6.8 Velocity Saturation 219
6.9 MOSFET IV Model with Velocity Saturation 220
6.10 Parasitic Source-Drain Resistance 225
6.11 Extraction of the Series Resistance and the Effective Channel Length 226
6.12 Velocity Overshoot and Source Velocity Limit 228
6.13 Output Conductance 229
6.14 High-Frequency Performance 230
6.15 MOSFET Noises 232
6.16 SRAM, DRAM, Nonvolatile (Flash) Memory Devices 238
6.17 Chapter Summary 245
PROBLEMS 247
REFERENCES 256
GENERAL REFERENCES 257
7
MOSFETs in ICs–Scaling, Leakage, and Other Topics 259
7.1 Technology Scaling–For Cost, Speed, and Power Consumption 259
7.2 Subthreshold Current–“Off” Is Not Totally “Off” 263
7.3 Vt Roll-Off–Short-Channel MOSFETs Leak More 266
7.4 Reducing Gate-Insulator Electrical Thickness and Tunneling Leakage 270
7.5 How to Reduce Wdep 272
7.6 Shallow Junction and Metal Source/Drain MOSFET 274
7.7 Trade-Off Between Ion and Ioff and Design for Manufacturing 276
7.8 Ultra-Thin-Body SOI and Multigate MOSFETs 277
7.9 Output Conductance 282
7.10 Device and Process Simulation 283
7.11 MOSFET Compact Model for Circuit Simulation 284
7.12 Chapter Summary 285
PROBLEMS 286
REFERENCES 288
GENERAL REFERENCES 289
8
Bipolar Transistor 291
8.1 Introduction to the BJT 291
8.2 Collector Current 293
8.3 Base Current 297
8.4 Current Gain 298
8.5 Base-Width Modulation by Collector Voltage 302
8.6 Ebers—Moll Model 304
8.7 Transit Time and Charge Storage 306
8.8 Small-Signal Model 310
8.9 Cutoff Frequency 312
8.10 Charge Control Model 314
8.11 Model for Large-Signal Circuit Simulation 316
8.12 Chapter Summary 318
PROBLEMS 319
REFERENCES 323
GENERAL REFERENCES 323
Appendix I
Derivation of the Density of States 325
Appendix II
Derivation of the Fermi—Dirac Distribution Function 329
Appendix III
Self-Consistencies of Minority Carrier Assumptions 333
Answers to Selected Problems 337
Index 341
Notă biografică
Chenming Calvin Hu holds the TSMC Distinguished Professor Chair of Microelectronics at University of California, Berkeley. He is a member of the US Academy of Engineering and a foreign member of the Chinese Academy of Sciences. From 2001 to 2004, he was the Chief Technology Officer of TSMC. A Fellow of the Institute of Electrical and Electronic Engineers (IEEE), he has been honored with the Jack Morton Award in1997 for his research on transistor reliability, the Solid State Circuits Award in 2002 for co-developing the first international standard transistor model for circuit simulation, and the Jun-ichi Nishizawa Medal in 2009 for exceptional contributions to device physics and scaling. He has supervised over 60 Ph.D. student theses, published 800 technical articles, and received more than 100 US patents. His other honors include Sigma Xi Moni Ferst Award, R&D 100 Award, and UC Berkeley’s highest award for teaching — the Berkeley Distinguished Teaching Award.
For additional information, visit the author's Web site.
For additional information, visit the author's Web site.
Caracteristici
Two information-packed chapters (CH. 6 & 7) on modern MOSFETs: No other text offers such thorough coverage or so successfully reflects the importance of MOSFET in the IC technology of today and tomorrow. The author offers the most up-to-date information available, including roadblocks and ways to overcome these roadblocks. Some topics include: short-channel effects, leakage currents, velocity saturation, source injection-velocity limit, as well as those important to IC designers such as noise, voltage gain, design for manufacturing, and RF operation.
Timely topics like solar cells and light emitting diode/solid-state lighting: This text offers timely topics of renewable electricity generation and energy conservation using semiconductor devices, integrated into an organized introduction of device concepts with applications beyond energy and power. See Sections 4.12 and 4.13.
Interesting topics that break up long passages of text: Long chapters on MOS capacitor and MOSFET that are dense with mathematical theory are broken up with coverage of important devices that are also interesting to students: CMOS imagers, SRAM, DRAM, flash memory, optical devices, and MESFET/HEMT. See Sections 5.10 and 6.16.
Liberal use of sidebars to keep student interested and introduce useful information: The author keeps students engaged while presenting topics that are often neglected in other texts like quotations of transistor and IC inventors, excerpts from the earliest MOSFET patents, thermoelectric generator and cooler, hot-carrier reliability, and more. See Sections 1.1, 2.1, 6.16.3, 7.1.
Timely topics like solar cells and light emitting diode/solid-state lighting: This text offers timely topics of renewable electricity generation and energy conservation using semiconductor devices, integrated into an organized introduction of device concepts with applications beyond energy and power. See Sections 4.12 and 4.13.
Interesting topics that break up long passages of text: Long chapters on MOS capacitor and MOSFET that are dense with mathematical theory are broken up with coverage of important devices that are also interesting to students: CMOS imagers, SRAM, DRAM, flash memory, optical devices, and MESFET/HEMT. See Sections 5.10 and 6.16.
Liberal use of sidebars to keep student interested and introduce useful information: The author keeps students engaged while presenting topics that are often neglected in other texts like quotations of transistor and IC inventors, excerpts from the earliest MOSFET patents, thermoelectric generator and cooler, hot-carrier reliability, and more. See Sections 1.1, 2.1, 6.16.3, 7.1.