Physical and Technical Problems of Soi Structures and Devices: NATO Science Partnership Sub-Series: 3:, cartea 4
Autor Jean-Pierre Colinge Editat de J. -P Colinge, Vladimir S. Lysenkoen Limba Engleză Hardback – 31 mai 1995
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Specificații
ISBN-13: 9780792336006
ISBN-10: 0792336003
Pagini: 300
Dimensiuni: 160 x 240 mm
Greutate: 0.6 kg
Editura: Kluwer Academic Publishers
Seria NATO Science Partnership Sub-Series: 3:
Locul publicării:Dordrecht, Netherlands
ISBN-10: 0792336003
Pagini: 300
Dimensiuni: 160 x 240 mm
Greutate: 0.6 kg
Editura: Kluwer Academic Publishers
Seria NATO Science Partnership Sub-Series: 3:
Locul publicării:Dordrecht, Netherlands
Public țintă
ResearchCuprins
Preface. Contributors. SOI materials: Low dose SIMOX for ULSI applications; A.J. Auberton-Hervé, et al. Why porous silicon for SOI? V.P. Bondarenko, A.M. Dorofeev. Defect engineering in SOI films prepared by zone-melting recrystallization; E.I. Givargizov, et al. Ion beam processing for SOI; W. Skorupa. Semi-insulating oxygen-doped silicon by low temperature chemical vapor deposition for SOI applications; J.C. Sturm, et al. Direct formation of thin film nitride structures by high intensity ion implantation of nitrogen into silicon; R. Yankov, F. Komarov. Stimulated technology for implanted SOI formation; V.G. Litovchenko, et al. Behaviour of oxygen and nitrogen atoms sequentially implanted into silicon; A.B. Danilin. SOI fabrication by silicon wafer bonding with the help of glass-layer fusion; N.I. Koshelev, et al. Crystallization of a-Si films on glasses by multipulse- excimer-laser technique; A.B. Limanov. Microzone laser recrystallized polysilicon layers on insulator; A.A. Druzhinin, et al. SOI materials characterization techniques: Electrical characterization techniques for SOI materials and devices; S. Christoloveanu. The defect structure of buried oxide layers in SIMOX and BESOI structures; A.G. Revesz, H.L. Hughes. IR study of buried layer structure on different stages of technology; V.G. Litovchenko, et al. Optical investigation of silicon implanted with high doses of oxygen and hydrogen ions; P.A. Aleksandrov, et al. Electrical properties of ZMR SOI structures: characterization techniques and experimental results; T.E. Rudenko et al. SOI Devices: Fabrication and characterisation of poly-Si TFTs on glass; S.D. Brotherton, et al. Hot carrier reliability of SOI structures; D.E. Ioannou. Novel TESC bipolar transistor approach for a thin-film SOI substrate; C.J. Patel, et al. Problems of radiation hardness of SOI structures and devices; A.N. Nazarov. Fabrication of SIMOX structures and ICs test elements; G.G. Voronin, et al. Low-frequency noise characterization of SOI depletion-mode p- MOSFETS; N.B. Lukyanchikova, et al. SOI circuits: SOI devices and circuits: an overview of potentials and problems; J.-P. Colinge. 1.2 &mgr; CMOS/SOI on porous silicon; V.P. Bondarenko, et al. SOI pressure sensors based on laser recrystallized polysilicon; V.A. Voronin, et al. Index.