Printed Circuit Engineering: Optimizing for Manufacturability
Autor Raymond H. Clarken Limba Engleză Paperback – 11 mar 2012
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Specificații
ISBN-13: 9789401170055
ISBN-10: 9401170053
Pagini: 260
Ilustrații: XII, 244 p.
Dimensiuni: 152 x 229 x 14 mm
Greutate: 0.35 kg
Ediția:Softcover reprint of the original 1st ed. 1989
Editura: SPRINGER NETHERLANDS
Colecția Springer
Locul publicării:Dordrecht, Netherlands
ISBN-10: 9401170053
Pagini: 260
Ilustrații: XII, 244 p.
Dimensiuni: 152 x 229 x 14 mm
Greutate: 0.35 kg
Ediția:Softcover reprint of the original 1st ed. 1989
Editura: SPRINGER NETHERLANDS
Colecția Springer
Locul publicării:Dordrecht, Netherlands
Public țintă
ResearchCuprins
1. Introduction To Standards and Specifications.- 2. Understanding Blueprints.- 3. Processes And Tolerances.- 4. Artwork Inspection.- 5. Planning: Multilayer And Double Sided Printed Circuits.- 6. Planning Flex And Rigid-Flex Jobs.- 7. Aspects Of Quality Assurance.- A. MIL-STD-275E: Printed Wiring for Electronic Equipment.- B. IPC-D-300G: Printed Board Dimensions and Tolerances.- C. MIL-P-55110D: General Specification for Printed Wiring Boards.- D. IPC-A-600C: Guidelines for Acceptability of Printed Boards.- E. MIL-P-13949F: Plastic Sheet, Laminated, Metal Clad (For Printed Wiring Boards).- F. MIL-STD-2118: Design Requirements for Flex and Rigid-Flex Printed Wiring for Electronic Equipment.