The presented Proceedings are an important result of the kick-off meeting organized within the scope of the EUREKA E!4750-Project "New Generation of 3D Integrated Passive Components and Microsystems in LTCC TECHnology" (6 to 8 of April 2010). The event was hosted by the Institute of Sensor and Actuator Systems, Vienna University of Technology. The kick-off meeting was held at the Austrian Trend Hotel Savoyen Vienna.The kick-off meeting was attended by 23 researchers and engineers from project partners from Austria (Institute of Sensor and Actuator Systems and OnkoTec GmbH), Slovenia (Jozef Stefan Institute and HIPOT-RR), Poland (Institute of Electron Technology), and Serbia (Faculty of Technical Sciences). Representatives of research institutions and companies involved in the E!4750-Project presented their achievements and valuable research results.Outstanding reviewers, Prof. Andrzej Dziedzic, Dr. Luc Federzoni, Prof. Per Johander, Prof. Alena Pietriková, Prof. Maria Prudenziati, and Prof. Ivan Szendiuch, helped us to achieve a high scientific level of the published articles. We are grateful for their dedication and professionalism.We hope that the Proceedings are a useful publication for researchers, engineers, experts and others who deal in the very interesting field of integrated passive components and microsystems.