Reliability of RoHS-Compliant 2D and 3D IC Interconnects de John Lau

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

John Lau

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Proven 2D and 3D IC lead-free interconnect reliability techniques

Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.
Covers reliability of:

2D and 3D IC lead-free interconnects
CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints
Lead-free (SACX) solder joints
Low-temperature lead-free (SnBiAg) solder joints
Solder joints with voids, high strain rate, and high ramp rate
VCSEL and LED lead-free interconnects
3D LED and 3D MEMS with TSVs
Chip-to-wafer (C2W) bonding and lead-free interconnects
Wafer-to-wafer (W2W) bonding and lead-free interconnects
3D IC chip stacking with low-temperature bonding
TSV interposers and lead-free interconnects
Electromigration of lead-free microbumps for 3D IC integration

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Cuprins

Ch 1. Introduction to RoHS Compliant Semiconductor and Packaging Technologies; Ch 2. Reliability Engineering of Lead-Free Interconnects; Ch 3. Notes on Failure Criterion; Ch 4. Reliability of 1657-Pin CCGA Lead-Free Solder Joints; Ch 5. Reliability of PBGA Lead-Free Solder Joints (With and Without Underfills); Ch 6. Reliability of LED Lead-Free Interconnects; Ch 7. Reliability of VCSEL Lead-Free Interconnects; Ch 8. Reliability of Low-Temperature Lead-Free (SnBiAg) Solder Joints; Ch 9. Reliability of Lead-Free (SACX) Solder Joints; Ch 10. Chip-to-Wafer (C2W) Bonding and Lead-Free Interconnect Reliability; Ch 11. Wafer-to-Wafer (W2W) Bonding and Lead-Free Interconnect Reliability; Ch 12. Through-Silicon-Via (TSV) Interposer Reliability; Ch 13. Electromigration of Lead-Free Microbumps for 3D IC Integration; Ch 14. Effects of Dwell-Time and Ramp-Rate on SAC Thermal Cycling Test Results; Ch 15. Effects of High Strain Rate (Impact) on SAC Solder Balls/Bumps; Ch 16. Effects of Voids on Solder Joints Reliability; Index