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Semiconductor Device & Failure Analysis – Using Photon Emmission Microscopy

Autor WK Chim
en Limba Engleză Hardback – 9 noi 2000
The diminishing size and greater complexity of modern semiconductor integrated circuits poses new challenges in fault detection. Photon Emission Microscopy (PEM) is a physical fault localisation technique used for analysing IC failures. Detailing the PEM technique and its application to semiconductor device analysis, this unique reference:
* Illustrates the application of the PEM technique in various areas of device reliability, in particular hot-carrier, oxide and ESD reliability.
* Presents the principles of design and calibration for a spectroscopic emission microscope system along with coverage of the three main operation modes: frontside, backside and spectroscopic PEM
* Provides an analysis of light emission in semiconductors under hot-carrier and high-field impulse stressing in MOS transistors and photon emission from biased MOS capacitors.
Not only an essential reference for researchers and students in the field, the numerous practical examples throughout the text also make this an indispensible guide for failure analysis engineers and microelectrics industry professionals.
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Specificații

ISBN-13: 9780471492405
ISBN-10: 047149240X
Pagini: 288
Dimensiuni: 176 x 262 x 21 mm
Greutate: 0.72 kg
Editura: Wiley
Locul publicării:Chichester, United Kingdom

Public țintă

1. Postgraduates studying microelectronics, devices and processes. 2. Practising failure analysts and microelectronics engineers concerned with quality, reliability, testing and circuit design.

Cuprins


Notă biografică

Wai Kin Chim is the author of Semiconductor Device and Failure Analysis: Using Photon Emission Microscopy, published by Wiley.


Descriere

Fault detection has become increasingly difficult as integrated circuits become more and more complex. Photon Emission Microscopy (PEM) is a physical failure analysis technique which locates and identifies faults in integrated circuits.