Semiconductor Device & Failure Analysis – Using Photon Emmission Microscopy
Autor WK Chimen Limba Engleză Hardback – 9 noi 2000
* Illustrates the application of the PEM technique in various areas of device reliability, in particular hot-carrier, oxide and ESD reliability.
* Presents the principles of design and calibration for a spectroscopic emission microscope system along with coverage of the three main operation modes: frontside, backside and spectroscopic PEM
* Provides an analysis of light emission in semiconductors under hot-carrier and high-field impulse stressing in MOS transistors and photon emission from biased MOS capacitors.
Not only an essential reference for researchers and students in the field, the numerous practical examples throughout the text also make this an indispensible guide for failure analysis engineers and microelectrics industry professionals.
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Specificații
ISBN-13: 9780471492405
ISBN-10: 047149240X
Pagini: 288
Dimensiuni: 176 x 262 x 21 mm
Greutate: 0.72 kg
Editura: Wiley
Locul publicării:Chichester, United Kingdom
ISBN-10: 047149240X
Pagini: 288
Dimensiuni: 176 x 262 x 21 mm
Greutate: 0.72 kg
Editura: Wiley
Locul publicării:Chichester, United Kingdom
Public țintă
1. Postgraduates studying microelectronics, devices and processes. 2. Practising failure analysts and microelectronics engineers concerned with quality, reliability, testing and circuit design.Cuprins
Notă biografică
Wai Kin Chim is the author of Semiconductor Device and Failure Analysis: Using Photon Emission Microscopy, published by Wiley.
Descriere
Fault detection has become increasingly difficult as integrated circuits become more and more complex. Photon Emission Microscopy (PEM) is a physical failure analysis technique which locates and identifies faults in integrated circuits.