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Semiconductor Wafer Bonding – Science and Technology de Tong

Semiconductor Wafer Bonding – Science and Technology: The ECS Series of Texts and Monographs

Autor Tong
en Limba Engleză Hardback – 17 dec 1998
Bonding - eine Technik zum "Verschweißen" von Halbleiter-Wafers ohne "Klebstoff" - wird in der Mikroelektronik, Energieelektronik, Mikromechanik, Optoelektronik und anderen Bereichen verbreitet eingesetzt. Dieser Band sammelt und systematisiert die in der Literatur verstreuten Informationen zum Wafer-Bonding; es finden sich beispielsweise Kapitel zum Bonding bei Raumtemperatur, zur Wärmebehandlung, zum Bonding ungleicher Materialien und strukturierter Wafers. (01/99)
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Specificații

ISBN-13: 9780471574811
ISBN-10: 0471574813
Pagini: 320
Dimensiuni: 156 x 234 x 19 mm
Greutate: 0.57 kg
Ediția:New.
Editura: Wiley
Seria The ECS Series of Texts and Monographs

Locul publicării:Hoboken, United States

Public țintă

Materials Scientists and Engineers, Graduate Students and Professionals in Solid State Science and Electronics (Physics, Inorganic Chemistry, Materials Science, Electronics and Electrical Engineering).

Cuprins

Descriere

Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field.