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Sic Power Module Design: Performance, Robustness and Reliability: Energy Engineering

Editat de Alberto Castellazzi, Andrea Irace
en Limba Engleză Hardback – 3 feb 2022
Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carbide (SiC) MOSFETs and diodes.
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Specificații

ISBN-13: 9781785619076
ISBN-10: 1785619071
Pagini: 360
Dimensiuni: 160 x 239 x 25 mm
Greutate: 0.66 kg
Editura: Institution of Engineering and Technology
Colecția Energy Engineering
Seria Energy Engineering