SiP–System in Package Design and Simulation – Mentor Graphics Expedition Enterprise Flow Advanced Design Guide
Autor S Lien Limba Engleză Hardback – 10 sep 2017
Preț: 922.92 lei
Preț vechi: 1014.20 lei
-9% Nou
Puncte Express: 1384
Preț estimativ în valută:
176.65€ • 183.61$ • 146.32£
176.65€ • 183.61$ • 146.32£
Carte tipărită la comandă
Livrare economică 05-19 februarie 25
Preluare comenzi: 021 569.72.76
Specificații
ISBN-13: 9781119045939
ISBN-10: 1119045932
Pagini: 496
Dimensiuni: 179 x 252 x 28 mm
Greutate: 0.91 kg
Editura: Wiley
Locul publicării:Singapore, Singapore
ISBN-10: 1119045932
Pagini: 496
Dimensiuni: 179 x 252 x 28 mm
Greutate: 0.91 kg
Editura: Wiley
Locul publicării:Singapore, Singapore
Public țintă
P&R Tier 2Primary: SiP designers, package designers, advanced PCB designers, system designers interested in electronic system minimization
Secondary: Package design managers; senior graduate students on electrical engineering courses
Cuprins
Notă biografică
Mr. Suny Li (Li Yang) is a SiP/PCB Technical Specialist in China; he now works in AcconSys Technology Co. Ltd, (a Mentor Authorized Distributor for China). Suny has guided and consulted on dozens of SiP projects in China, accumulating plentiful experience in SiP design and simulation. Suny has 10 years' experience in and knowledge of Application Engineer for Mentor, especially in SiP/PCB design and simulation. Before this, Suny worked in the Chinese Academy of Science and SIEMENS for several years. He has more than seven years' experience in hardware design (HW system design, PCB layout, high-speed signal integrity, power integrity, EMI, etc.). In the course of his work, Suny has published papers and acquired four patents, and he continues with this work. Suny is a senior member of the Chinese Institute of Electronics (CIE) and a member of the IEEE. Suny graduated from Beijing University of Aeronautics & Astronautics (BUAA) in 2000, receiving Master's and Bachelor's degrees in Science and Technology of Aeronautics & Astronautics.
Descriere
An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow.