The Electronics Assembly Handbook
Editat de Frank Riley, Electronic Packaging and Productionen Limba Engleză Paperback – 3 oct 2013
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Specificații
ISBN-13: 9783662131633
ISBN-10: 3662131633
Pagini: 628
Ilustrații: XIX, 603 p.
Dimensiuni: 203 x 254 x 33 mm
Greutate: 1.23 kg
Ediția:Softcover reprint of the original 1st ed. 1988
Editura: Springer Berlin, Heidelberg
Colecția Springer
Locul publicării:Berlin, Heidelberg, Germany
ISBN-10: 3662131633
Pagini: 628
Ilustrații: XIX, 603 p.
Dimensiuni: 203 x 254 x 33 mm
Greutate: 1.23 kg
Ediția:Softcover reprint of the original 1st ed. 1988
Editura: Springer Berlin, Heidelberg
Colecția Springer
Locul publicării:Berlin, Heidelberg, Germany
Public țintă
ResearchCuprins
Systems, vision and components in electronics assembly.- Manging automated electronics assembly.- PCB production equipment.- Modern platers and etchers.- Chemicals in PCB manufacturing.- Cleaning PCBs for higher quality.- Producing quality multilayer PCBs.- Plasma desmearing.- Chip-on-board technology.- Chip-and-wire technology.- TAB and flip-chip technology.- Component insertion equipment.- Workstations.- Automatic component insertion/placement systems.- Automated pin insertion.- Automated placement techniques.- Assembly challenges.- Robots in the electrical and electronics industry.- Consistency and quality using robots.- Robot hand exchangers.- Vision-guided assembly.- Vibratory insertion process: A new approach to non-standard component insertion.- SMT growth.- Realizing the benefits of SMT.- Designing reliability into surface-mount assemblies.- Design solutions.- Choosing SMT and setting up a facility.- SMT advantages.- Pick-and-place machines.- Surface-mount assembly using machine vision.- SMD placement using machine vision.- Hot-air leveling.- Testability circuit and board access problems.- Conductive epoxy for SMT solder replacement.- The removal and replacement of SMCs.- New applications.- New materials and equipment.- Integral substrate package technology.- Solder/cleaning, test and rework.- Solder joint acceptability.- Wave solder defects.- Soldering system trends.- Wave soldering: A study in process control.- Optimizing the wave soldering process.- Computerized soldering systems.- Re-examination of soldering techniques.- Adhesives for SMD wave soldering.- Adhesive evaluation.- Solder coating and leveling.- Screen printing.- Solvent flushing.- Rosin solder flux residues.- Aqueous cleaning.- Cleaning surface-mounted assemblies.- Desoldering components.- Bare-board testing.- Automatic optical inspection systems.- Machine vision.- Component testers and handlers.- Handlers.- Lead scanning.- Probe design and test fixturing.- Inspection equipment.- Image processing and non-destructive testing.- Design of SMA for testability.- Test and inspection of hybrid microcircuits.- In-circuit and functional ATE.- Functional test.- Test program development and processing power.- Robotic automated-test workcells.- Clean room technology.- Modular clean rooms.- Clean room air monitoring.- ESD control.- Static shielding techniques.- Computer control of modern factory operations.- Electronics CAE/CAD/CAM.- CAD/CAM for PCB manufacturing.- Designing PCBs for surface-mount assemblies.- CAD in hybrid production.- Discrete wired circuit board production.- Automating the assembly of electronic products.- Test, rework and inspection management costs.- Flexible manufacturing.- Computer simulation.- Local area networks.- Materials handling accessories.- Automated PCB handling.- Automated guided vehicle systems.- Batch-of-one assembly.- FMS for PCB assembly.- PCB assembly and test.- Factory control and robotic systems.- Authors’ organizations and addresses.