Thermal Management of Electronic Systems II: Proceedings of EUROTHERM Seminar 45, 20–22 September 1995, Leuven, Belgium
Editat de E. Beyne, C. J. M. Lasance, J. Berghmansen Limba Engleză Paperback – 5 noi 2012
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Specificații
ISBN-13: 9789401063180
ISBN-10: 9401063184
Pagini: 376
Ilustrații: XI, 361 p.
Dimensiuni: 160 x 240 x 20 mm
Greutate: 0.53 kg
Ediția:Softcover reprint of the original 1st ed. 1997
Editura: SPRINGER NETHERLANDS
Colecția Springer
Locul publicării:Dordrecht, Netherlands
ISBN-10: 9401063184
Pagini: 376
Ilustrații: XI, 361 p.
Dimensiuni: 160 x 240 x 20 mm
Greutate: 0.53 kg
Ediția:Softcover reprint of the original 1st ed. 1997
Editura: SPRINGER NETHERLANDS
Colecția Springer
Locul publicării:Dordrecht, Netherlands
Public țintă
ResearchCuprins
1. Invited Lectures.- The Numerical Modelling of Heat Transfer in Electronic Systems : Challenges and Ideas of Answer.- DELPHI — A Status Report on the ESPRIT funded Project for the Creation and Validation of Thermal Models of Electronic Parts.- Temperature Effects on Reliability.- 2. Analytical and Computational Thermal Modeling.- Numerical Simulation of Combined Conduction-Radiation Heat Transfer in PCB Assemblies for Space Applications — Experimental Validation.- Conjugate Model of a Pinned-Finned Heat-sink Using a Hybrid Conductance and CFD Model within an Integrated MCAE Tool.- Analysis of 3D Conjugate Heat Transfer in Electronic Boards: Interaction between Three Integrated Circuits.- Heat Transfer in Tridimensional Plastic Packages Stacks of Memory Chips.- Electrothermal Simulation of Analogue Integrated Circuits with ETS.- Calculations of the Temperature Distribution throughout Electronic Equipments by the Boundary Element Method.- An Interactive Thermal Characterisation of Component Placement.- 3. Thermal Characterisation.- Thermal Characterization of Electronic Devices by means of Improved Boundary Condition Independent Compact Models.- Experimental Validation Methods for Thermal Models.- Experimental Thermal Characterisation of Electronic Packages in a Fluid Bath Environment.- Modelling of IC-Packages based on Thermal Characteristics.- Characterisation of Thermally Enhanced Plastic Packages.- Thermal Characterization of Multistripe Heterostructure Lasers.- Application of Thermal Territories for Air Cooled Circuit Board Design.- Thermal Impedance Evaluation for Industrial Power Profiles.- Thermal Characterisation and Modélisation of Multichip Modules using Standard Electronic Packages.- Measurement of Practical Thermal Resistance Values for Multi-CavitiesPower Hybrids (MCPH) in a Vacuum Environment.- 4. Single and Multi-Phase Convective Cooling.- Flow Boiling and Film Condensation Heat Transfer in Narrow Channels of Thermosiphons for Cooling of Electronic Components.- Application of Phase Change Materials (PCMs) to the Passive Thermal Control of a Plastic Quad Flat Package: Effect of Orientation of the Package.- High Performance Air Cooled Heat-sinks for Power Packages.- Thermal Control of Broadcast Transmitters by Air Cooled Cold Plates.- Natural Convection Experiments with Cuboids and Cylinders of Equal Area.- Natural Convection Heat Transfer of Metal Cuboids Flush-Mounted in a Horizontal Plate.- 5. Measurement Techniques.- Visualisation of Natural Convection in Inclined Heated Parallel Plates.- New Jedec Standards for Thermal Measurements: Review and Examples.- Experimental Study on Local Convective Heat Transfer from Protruding Cubical Components.- Modelling of Axial Fans for Electronic Equipment.- 6. Thermomechanical Modelling.- Thermal Degradation of Power Modules.- Thermal and Thermomechanical Modelling of Ball Grid Array Packages.- Thermal and Thermomechanical Evaluation of a “Chip in Moulded Interconnect Device”.- Thermal and Mechanical Characterization of Electronic Packages in Extremely High Frequency Applications by means of Finite Element Analysis.- Author Index.