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Three-Dimensional Molded Interconnect Devices (3D-Mid): Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers de Jörg Franke

Three-Dimensional Molded Interconnect Devices (3D-Mid): Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers

Editat de Jörg Franke
en Limba Engleză Hardback – 2 apr 2014
This book offers a comprehensive insight into the state of the art in 3D-MID technology along the entire process chain. Individual chapters, moreover, deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.
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Specificații

ISBN-13: 9781569905517
ISBN-10: 1569905517
Pagini: 356
Dimensiuni: 179 x 2405 x 39 mm
Greutate: 1 kg
Editura: Carl Hanser Publishers

Notă biografică

Prof. Dr.-Ing. Jörg Franke ist Leiter des Lehrstuhls für Fertigungsautomatisierung und Produktionssystematik (FAPS) an der Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU).