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Through-Silicon Vias for 3D Integration de John Lau

Through-Silicon Vias for 3D Integration

Autor John Lau
en Limba Engleză Hardback – 16 dec 2012
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.


A comprehensive guide to TSV and other enabling technologies for 3D integration

Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edgeinformation on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.
This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.
Coverage includes:
  • Nanotechnology and 3D integration for the semiconductor industry
  • TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing
  • TSVs: mechanical, thermal, and electrical behaviors
  • Thin-wafer strength measurement
  • Wafer thinning and thin-wafer handling
  • Microbumping, assembly, and reliability
  • Microbump electromigration
  • Transient liquid-phase bonding: C2C, C2W, and W2W
  • 2.5D IC integration with interposers
  • 3D IC integration with interposers
  • Thermal management of 3D IC integration
  • 3D IC packaging
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Specificații

ISBN-13: 9780071785143
ISBN-10: 0071785140
Pagini: 512
Ilustrații: ill
Dimensiuni: 160 x 236 x 23 mm
Greutate: 0.85 kg
Editura: McGraw Hill Education
Colecția McGraw-Hill
Locul publicării:United States

Cuprins

1. Introduction to Microelectronics and Nanoelectronics
2. Origin and Evolution of 3D Integration
3. Trends and Outlook of 3D IC Packaging
4. Through-Silicon Vias (TSVs) Technology
5. Challenges and Outlook of 3D Si Integration
6. Challenges and Outlook of 3D IC Integration
7. Thin-Wafer Strength Measurements
8. Thin-Wafer Handling
9. Low-Cost Microbumping
10. C2C and C2W Bonding with Microbumps
11. Low Temperature Bonding
12. Electromigration of Microbump Assemblies
13. Memory Stacking Methods
14. Active TSV Interposers
15. Passive TSV Interposers
16. Thermal Management of 3D IC Integration
17. 3D IC and CIS Integration
18. 3D IC and MEMS Integration
19. 3D IC and LED Integration
20. Embedded 3D Hybrid IC and Opto-electronic Integration in Organic Substrates