Troubleshooting Rubber Problems: Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers
Autor John Sommeren Limba Engleză Hardback – 31 dec 2013
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Specificații
ISBN-13: 9781569905531
ISBN-10: 1569905533
Pagini: 297
Dimensiuni: 169 x 244 x 25 mm
Greutate: 0.7 kg
Editura: Hanser Gardner Publications
ISBN-10: 1569905533
Pagini: 297
Dimensiuni: 169 x 244 x 25 mm
Greutate: 0.7 kg
Editura: Hanser Gardner Publications
Notă biografică
John Sommer has a lifetime of experience in research and development in the rubber industry. He has worked for several rubber companies, most notably in the research division of Gencorp in Akron, OH, where he was employed for 28 years. He has subsequently taught rubber-related seminars at several universities and at the Rubber Division of the American Chemical Society.