Unraveling Bluetooth LE Audio: Stretching the Limits of Interoperable Wireless Audio with Bluetooth Next-Generation Low Energy Audio Standards
Autor Himanshu Bhalla, Oren Haggaien Limba Engleză Paperback – 16 mar 2021
Explore
how
Bluetooth
Low
Energy
(LE)
has
transformed
the
audio
landscape,
from
music
streaming
to
voice
recognition
applications.
This
book
describes
the
rationale
behind
moving
to
LE
audio,
the
potential
power
savings,
and
how
various
specifications
need
to
be
linked
together
to
develop
a
final
end
product.
LE Audio is a natural development of the Bluetooth audio standard. The standard is spread across more than a dozen different specifications, from application profiles, down to the core transports in both Host part and Controller part. You'll see how this new architecture of the Bluetooth audio stack defines a LE Audio stack from the Core Controller to the Host Protocols, and Profiles.
You’ll also learn how to free yourself from wires and charging. LE Audio introduces a new audio compression codec called LC3 (Low Complexity Communication Codec), which covers sampling rates for the full range of voice and media application at high fidelity, low complexity and low bit-rate and is ideal for new applications – such as voice assistance and gaming.
Unraveling Bluetooth Low Energy Audioprovides full context to anyone who is curious to learn about the new LE Audio technology.
LE Audio is a natural development of the Bluetooth audio standard. The standard is spread across more than a dozen different specifications, from application profiles, down to the core transports in both Host part and Controller part. You'll see how this new architecture of the Bluetooth audio stack defines a LE Audio stack from the Core Controller to the Host Protocols, and Profiles.
You’ll also learn how to free yourself from wires and charging. LE Audio introduces a new audio compression codec called LC3 (Low Complexity Communication Codec), which covers sampling rates for the full range of voice and media application at high fidelity, low complexity and low bit-rate and is ideal for new applications – such as voice assistance and gaming.
Unraveling Bluetooth Low Energy Audioprovides full context to anyone who is curious to learn about the new LE Audio technology.
What
You'll
Learn
- Understand the advantages of LE audio over current standards
- Describe the overall Bluetooth LE audio stack and its various blocks
- Enable LE audio with the Core Controller specification
- See how an end-to-end application works its through the LE audio ecosystem
- Examine how LE Audio addresses current and future trends in interoperable wireless audio
The
target
audience
for
this
book
are
developers,
manufacturers,
students,
lecturers,
teachers,
technology
geeks,
platform
integrators,
and
entrepreneurs.
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Specificații
ISBN-13: 9781484266571
ISBN-10: 1484266579
Pagini: 224
Dimensiuni: 155 x 235 mm
Greutate: 0.35 kg
Ediția:1st ed.
Editura: Apress
Colecția Apress
Locul publicării:Berkeley, CA, United States
ISBN-10: 1484266579
Pagini: 224
Dimensiuni: 155 x 235 mm
Greutate: 0.35 kg
Ediția:1st ed.
Editura: Apress
Colecția Apress
Locul publicării:Berkeley, CA, United States
Cuprins
Unraveling
Bluetooth
Low
Energy
Audio
Chapter
1.
Introduction
Chapter
2.
Bluetooth
Overview
Chapter
3.
One
Architecture
Overview
Chapter
4.
App
Layer
Chapter
5.
Control
Layer
Chapter
6.
LC3
Codec
Chapter
7.
Transport
Layer
Chapter
8.
Vision
Notă biografică
Himanshu
Bhallais
a
Software
Architect
in
the
Client
Computing
Group
(CCG)
inside
Intel
Corporation
and
is
based
out
of
Bengaluru,
India.
He
is
a
Computer
Science
graduate
of
IIT-BHU
(Indian
Institute
of
Technology
-
(BHU),
Varanasi)
and
has
over
17
years
of
experience
in
Software
architecture,
design
and
development.
He
spent
most
of
his
career
in
the
Bluetooth
and
wireless
technology
domain.
During
the
start
of
his
career
he
was
involved
with
a
startup
(Impulsesoft)
which
was
behind
one
of
the
world’s
first
Bluetooth
combined
(HF
and
A2DP)
audio
headsets
in
the
market.
He
later
worked
with
Broadcom
where
he
was
the
architect
for
Bluetooth
Software
on
Samsung
Tizen
DTV
and
received
a
key
achievement
award
for
it.
He
also
contributed
to
Wi-Fi
Direct
Services
(WFDS)
standard
and
represented
Broadcom
in
the
Wi-Fi
Alliance.
In
Intel,
he
contributed
to
Wi-Fi
Serial
Bus
(WSB)
standard
and
was
instrumental
in
developing
MAUSB
(Media
Agnostic
USB)
Software
technology.
He
was
a
key
contributor
to
Bluetooth
Low
Energy
Audio
standard
and
was
editor
of
multiple
critical
specifications
(ASCP,
BAP,
etc.).
He
received
the
prestigious
“Outstanding
New
Contributor
of
the
year”
award
for
this
work
from
the
Chairman
of
Board
of
Directors
of
Bluetooth
SIG
during
the
Working
Group
Summit
in
Kirkland
in
2018
-
this
award
is
based
on
anonymous
voting
by
the
members
of
the
Bluetooth
SIG
Working
Groups.
For
this,
he
was
featured
on
the
Bluetooth
SIG
website
and
also
on
Bluetooth
SIG
LinkedIn
account,
and
this
was
written
about
him
-
“The
procedures
which
he
defined
are
a
corner
stone
for
LE
audio”.
He
was
also
interviewed
inside
Intel
and
his
interview
was
featured
in
the
company’s
“Inside
Blue”
portal.
He
also
represents
Intel
in
Bluetooth
Architecture
Review
Board
(BARB)
and
has
provided
feedback
to
over
20
specifications
spanning
across
various
Bluetooth
SIG
Working
Groups
(e.g.
Mesh,
ATA,
GA,
etc.).
He
is
also
a
prolific
inventor
and
has
4
patents
granted
and
4
more
filed
with
the
USPTO.
He
considers
this
book
as
an
attempt
to
give
back
to
the
technology
and
a
means
to
show
gratitude
to
everyone
involved
in
development
of
this
standard.
Oren Haggaiis a system architect in the wireless connectivity solutions group at Intel Israel, focusing on Bluetooth technology. He has over 20 years of experience working on various wireless products and standards. Over the years, he contributed to the specification development from early Bluetooth Core 0.7, 0.9, 1.0B, 1.1, 2.1, 4.1 and 5.2, until the latest state of the Bluetooth specifications. He began working on Bluetooth in 1999, while studying at the Technion university, Israel Institute of Technology, where he received a BSc in Computer and Software Engineering from the EE faculty. While at the university he integrated a Bluetooth stack for handheld PCs and phone form factors and instructed students in various Bluetooth projects. He designed and implemented a wireless local information system based on Bluetooth for the EE faculty at the Technion. He later joined a startup (Mobilian) in 2001 which integrated the world’s first single chip Wi-Fi/Bluetooth coexistence solution which was the basis of the PTA 3-wire standard. While at Mobilian he designed the world’s first wireless desktop system, enabling the concurrent operation of Bluetooth mouse, keyboard, A2DP music, file transfer, while co-running and co-exist with Wi-Fi networks. He joined Intel in 2003, as part of Mobilian’s acquisition by Intel. At Intel he designed and developed Bluetooth solutions for phones and PCs, and a quality of service based dynamic connection manager for cellular WiMAX networks. He wrote system requirements for Bluetooth Low energy for Intel products and became a Bluetooth training champion at Intel, providing training to multiple discipline teams from RF, analog, HW, VLSI, firmware software and validation. He designed numerous MAC and PHY modules in Wi-Fi and in Bluetooth, which are driving a few generations of Intel Wi-Fi/Bluetooth wireless solutions in today’s Intel based PCs. He is a member in the following Bluetooth SIG working groups: Audio Telephony and Automotive Working Group (ATAWG), Hearing Aids Working Group (HAWG), Generic Audio Working Group (GAWG) and Core Spec Working Group (CSWG). He contributed to every aspect of the LE Audio specifications in Controller, Host and Codec. He initiated the 0.7 version of the LE Audio stream control specifications, while defining the basic stream control quality of service procedures and coined a few popular LE Audio terms such as PAC (Published Audio Capability) and BASE (Broadcast Audio Source Endpoint). He holds several patents in the area of wireless communications. He sees the latest development in the Bluetooth specifications as an exciting era and a renaissance of the Bluetooth technology, and wishes to spread that knowledge to a wider audience.
Oren Haggaiis a system architect in the wireless connectivity solutions group at Intel Israel, focusing on Bluetooth technology. He has over 20 years of experience working on various wireless products and standards. Over the years, he contributed to the specification development from early Bluetooth Core 0.7, 0.9, 1.0B, 1.1, 2.1, 4.1 and 5.2, until the latest state of the Bluetooth specifications. He began working on Bluetooth in 1999, while studying at the Technion university, Israel Institute of Technology, where he received a BSc in Computer and Software Engineering from the EE faculty. While at the university he integrated a Bluetooth stack for handheld PCs and phone form factors and instructed students in various Bluetooth projects. He designed and implemented a wireless local information system based on Bluetooth for the EE faculty at the Technion. He later joined a startup (Mobilian) in 2001 which integrated the world’s first single chip Wi-Fi/Bluetooth coexistence solution which was the basis of the PTA 3-wire standard. While at Mobilian he designed the world’s first wireless desktop system, enabling the concurrent operation of Bluetooth mouse, keyboard, A2DP music, file transfer, while co-running and co-exist with Wi-Fi networks. He joined Intel in 2003, as part of Mobilian’s acquisition by Intel. At Intel he designed and developed Bluetooth solutions for phones and PCs, and a quality of service based dynamic connection manager for cellular WiMAX networks. He wrote system requirements for Bluetooth Low energy for Intel products and became a Bluetooth training champion at Intel, providing training to multiple discipline teams from RF, analog, HW, VLSI, firmware software and validation. He designed numerous MAC and PHY modules in Wi-Fi and in Bluetooth, which are driving a few generations of Intel Wi-Fi/Bluetooth wireless solutions in today’s Intel based PCs. He is a member in the following Bluetooth SIG working groups: Audio Telephony and Automotive Working Group (ATAWG), Hearing Aids Working Group (HAWG), Generic Audio Working Group (GAWG) and Core Spec Working Group (CSWG). He contributed to every aspect of the LE Audio specifications in Controller, Host and Codec. He initiated the 0.7 version of the LE Audio stream control specifications, while defining the basic stream control quality of service procedures and coined a few popular LE Audio terms such as PAC (Published Audio Capability) and BASE (Broadcast Audio Source Endpoint). He holds several patents in the area of wireless communications. He sees the latest development in the Bluetooth specifications as an exciting era and a renaissance of the Bluetooth technology, and wishes to spread that knowledge to a wider audience.
Textul de pe ultima copertă
Explore
how
Bluetooth
Low
Energy
(LE)
has
transformed
the
audio
landscape,
from
music
streaming
to
voice
recognition
applications.
This
book
describes
the
rationale
behind
moving
to
LE
audio,
the
potential
power
savings,
and
how
various
specifications
need
to
be
linked
together
to
develop
a
final
end
product.
LE Audio is a natural development of the Bluetooth audio standard. The standard is spread across more than a dozen different specifications, from application profiles, down to the core transports in both Host part and Controller part. You'll see how this new architecture of the Bluetooth audio stack defines a LE Audio stack from the Core Controller to the Host Protocols, and Profiles.
You’ll also learn how to free yourself from wires and charging. LE Audio introduces a new audio compression codec called LC3 (Low Complexity Communication Codec), which covers sampling rates for the full range of voice and media application at high fidelity, low complexity and low bit-rate and is ideal for new applications – such as voice assistance and gaming.
Unraveling Bluetooth Low Energy Audio provides full context to anyone who is curious to learn about the new LE Audio technology.
LE Audio is a natural development of the Bluetooth audio standard. The standard is spread across more than a dozen different specifications, from application profiles, down to the core transports in both Host part and Controller part. You'll see how this new architecture of the Bluetooth audio stack defines a LE Audio stack from the Core Controller to the Host Protocols, and Profiles.
You’ll also learn how to free yourself from wires and charging. LE Audio introduces a new audio compression codec called LC3 (Low Complexity Communication Codec), which covers sampling rates for the full range of voice and media application at high fidelity, low complexity and low bit-rate and is ideal for new applications – such as voice assistance and gaming.
Unraveling Bluetooth Low Energy Audio provides full context to anyone who is curious to learn about the new LE Audio technology.
You
will:
- Understand the advantages of LE audio over current standards
- Describe the overall Bluetooth LE audio stack and its various blocks
- Enable LE audio with the Core Controller specification
- See how an end-to-end application works its through the LE audio ecosystem
- Examine how LE Audio addresses current and future trends in interoperable wireless audio
Caracteristici
Understand
the
full
LE
Audio
ecosystem
including
how
to
use
LC3
Codec
Review current and future trends in interoperable wireless audio and see how LE Audio addresses these trends
Deep dive into the standards, capabilities, and use cases for Bluetooth LE audio
Review current and future trends in interoperable wireless audio and see how LE Audio addresses these trends
Deep dive into the standards, capabilities, and use cases for Bluetooth LE audio