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Wireless Interface Technologies for 3D IC and Module Integration

Autor Tadahiro Kuroda, Wai-Yeung Yip
en Limba Engleză Hardback – 29 sep 2021
Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.
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Specificații

ISBN-13: 9781108841214
ISBN-10: 110884121X
Pagini: 300
Dimensiuni: 177 x 251 x 24 mm
Greutate: 0.74 kg
Editura: Cambridge University Press
Colecția Cambridge University Press
Locul publicării:Cambridge, United Kingdom

Cuprins

1. Introduction – 3D integration and near-field coupling; 2. ThruChip interface – a wireless chip interface; 3. Transmission line coupler – a wireless module connector; 4. The future of computing – 3D SRAM for neural network, eBrain.

Notă biografică


Descriere

Synthesising fifteen years of research, this text provides a comprehensive treatment of two major technologies for wireless chip and module interface design.