Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators: NATO Science for Peace and Security Series B: Physics and Biophysics
Editat de Evgeni Gusev, Eric Garfunkel, Arthur Dideikinen Limba Engleză Hardback – 15 mar 2010
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SPRINGER NETHERLANDS – 30 iun 2010 | 1172.01 lei 6-8 săpt. | |
Hardback (1) | 1177.92 lei 6-8 săpt. | |
SPRINGER NETHERLANDS – 15 mar 2010 | 1177.92 lei 6-8 săpt. |
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Specificații
ISBN-13: 9789048138050
ISBN-10: 9048138051
Pagini: 314
Ilustrații: XI, 314 p.
Dimensiuni: 155 x 235 x 19 mm
Greutate: 0.64 kg
Ediția:2010
Editura: SPRINGER NETHERLANDS
Colecția Springer
Seria NATO Science for Peace and Security Series B: Physics and Biophysics
Locul publicării:Dordrecht, Netherlands
ISBN-10: 9048138051
Pagini: 314
Ilustrații: XI, 314 p.
Dimensiuni: 155 x 235 x 19 mm
Greutate: 0.64 kg
Ediția:2010
Editura: SPRINGER NETHERLANDS
Colecția Springer
Seria NATO Science for Peace and Security Series B: Physics and Biophysics
Locul publicării:Dordrecht, Netherlands
Public țintă
ResearchCuprins
MEMS/NEMS Technologies and Applications.- History of Early Research on MEMS in Russia (U.S.S.R.).- Challenges of Complete CMOS/MEMS Systems Integration.- MEMS for Practical Applications.- Nanochip: A MEMS-Based Ultra-High Data Density Memory Device.- Low Cost Silicon Coriolis’ Gyroscope Paves the Way to Consumer IMU.- Microwave and Millimetre Wave Devices Based on Micromachining of III-V Semiconductors.- Monocrystalline-Silicon Microwave MEMS Devices.- Three-Dimensional Photonic Crystals Based on Opal-Semiconductor and Opal-Metal Nanocomposites.- MEMS Device and Reliability Physics.- Pull-in Dynamics of Electrostatically Actuated Bistable Micro Beams.- Path Following and Numerical Continuation Methods for Non-Linear MEMS and NEMS.- The Impact of Dielectric Material and Temperature on Dielectric Charging in RF MEMS Capacitive Switches.- Advanced Processes and Materials.- Development of DRIE for the Next Generation of MEMS Devices.- Low-Temperature Processes for MEMS Device Fabrication.- High-Temperature Stable Au–Sn and Cu–Sn Interconnects for 3D Stacked Applications.- 3D Integration of MEMS and IC: Design, Technology and Simulations.- Low-Frequency Electronic Noise in the Back-Gated and Top-Gated Graphene Devices.- Modeling of Dry Etching in Production of MEMS.- XRD and Raman Study of Low Temperature AlGaAs/GaAs (100) Heterostructures.- Internal Stresses in Martensite Formation in Copper Based Shape Memory Alloys.- Sensors.- Smart Sensors: Advantages and Pitfalls.- Vertically Integrated MEMS SOI Composite Porous Silicon-Crystalline Silicon Cantilever-Array Sensors: Concept for Continuous Sensing of Explosives and Warfare Agents.- Integration of Diverse Biological Materials in Micro/Nano Devices.- Force Sensing Optimization and Applications.- Using ParametricResonance to Improve Micro Gyrsocope Robustness.
Caracteristici
State-of-the-art reviews from leading experts in the field of MEMS/NEMS devices and technologies The subject is covered from different angles, including technology, device designs, processing aspects, materials properties, characterization, microstructural studies Broad coverage from technology fundamentals all the way to device applications Includes supplementary material: sn.pub/extras