Advancements in Optical Methods, Digital Image Correlation & Micro-and Nanomechanics, Volume 4: Proceedings of the 2022 Annual Conference on Experimental and Applied Mechanics: Conference Proceedings of the Society for Experimental Mechanics Series
Editat de Ming-Tzer Lin, Cosme Furlong, Chi-Hung Hwang, Mohammad Naraghi, Frank DelRioen Limba Engleză Paperback – 12 feb 2024
DIC Methods & Its Applications
Photoelsticity and Interferometry Applications
Micro-Optics and Microscopic Systems Multiscale and New Developments in Optical Methods
Extreme Nanomechanics
In-Situ Nanomechanics
Expanding Boundaries in Metrology
Micro and Nanoscale Deformation
MEMS for Actuation, Sensing and Characterization
1D & 2D Materials
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Specificații
ISBN-13: 9783031174735
ISBN-10: 3031174739
Ilustrații: VII, 81 p. 79 illus., 65 illus. in color.
Dimensiuni: 210 x 279 mm
Greutate: 0.23 kg
Ediția:1st ed. 2023
Editura: Springer International Publishing
Colecția Springer
Seria Conference Proceedings of the Society for Experimental Mechanics Series
Locul publicării:Cham, Switzerland
ISBN-10: 3031174739
Ilustrații: VII, 81 p. 79 illus., 65 illus. in color.
Dimensiuni: 210 x 279 mm
Greutate: 0.23 kg
Ediția:1st ed. 2023
Editura: Springer International Publishing
Colecția Springer
Seria Conference Proceedings of the Society for Experimental Mechanics Series
Locul publicării:Cham, Switzerland
Cuprins
Innovations in Super Resolution Microscopy.- Measuring Strain Distribution Around Inclusions and Matrix Interface Using Global Digital Image Correlation.- Evaluation of Stress State and Fracture Strain of High-Strength Steel Using Stereo Image Correction.- Bistability and Irregular Oscillations in Pairs of Opto-thermal Micro-oscillators.- Noninvasive Shape Measurements by MEMS-based Fringe Projection with Application to Middle-ear Mechanics.- High-Speed Optical Extensometer for Uniaxial Kolsky Bar Experiments.- On the Miura Ori Modal Response: A Look Throughout the Experimental Side.- Using Digital Image Correlation to Characterize the Static and Dynamic Behavior of Structures: Industrial Applications and Lessons Learned.- Enabling Digital Image Correlation with High-Resolution Microscopic Optics via Working Distance Automation: Advancing Resolution and Accuracy Limits.- Characterization of Bioengineered Tissues by Digital Holographic Vibrometry and 3D Shape Deep Learning.- CoordinatedTwinning Bands in Magnesium at the Existence of Stress Raisers via in situ Microscopic Image Correlation.- Determining the Onset of Transverse Cracking in a Woven Composite using Digital Image Correlation.
Notă biografică
Ming-Tzer Lin - National Chung Hsing University, Taiwan; Cosme Furlong - Worcester Polytechnic Institute, USA; Chi-Hung Hwang-Instrument Technology Research Center, Taiwan; Mohammad Naraghi, Texas A&M University, USA; Frank DelRio, National Institutes of Standards and Technology, Boulder, CO, USA
Textul de pe ultima copertă
Advancements in Optical Methods, Digital Image Correlation & Micro-and Nanomechanics, Volume 4 of the Proceedings of the 2022 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the fourth volume of six from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of optical methods ranging from traditional photoelasticity and interferometry to more recent DIC and DVC techniques, and includes papers in the following general technical research areas:
DIC Methods & Its Applications
Photoelsticity and Interferometry Applications
Micro-Optics and Microscopic Systems Multiscale and New Developments in Optical Methods
Extreme Nanomechanics
In-Situ Nanomechanics
Expanding Boundaries in Metrology
Micro and Nanoscale Deformation
MEMS for Actuation, Sensing and Characterization
1D & 2D Materials
Photoelsticity and Interferometry Applications
Micro-Optics and Microscopic Systems Multiscale and New Developments in Optical Methods
Extreme Nanomechanics
In-Situ Nanomechanics
Expanding Boundaries in Metrology
Micro and Nanoscale Deformation
MEMS for Actuation, Sensing and Characterization
1D & 2D Materials