CMOS VLSI Engineering: Silicon-on-Insulator (SOI)
Autor James B. Kuo, Ker-Wei Suen Limba Engleză Hardback – 30 sep 1998
CMOS VLSI Engineering: Silicon-On-Insulator addresses three key factors in engineering SOI CMOS VLSI - processing technology, device modelling, and circuit designs are all covered with their mutual interactions. Starting from the SOI CMOS processing technology and the SOI CMOS digital and analog circuits, behaviors of the SOI CMOS devices are presented, followed by a CAD program, ST-SPICE, which incorporates models for deep-submicron fully-depleted mesa-isolated SOI CMOS devices and special purpose SOI devices including polysilicon TFTs.
CMOS VLSI Engineering: Silicon-On-Insulator is written for undergraduate senior students and first-year graduate students interested in CMOS VLSI. It will also be suitable for electrical engineering professionals interested in microelectronics.
Toate formatele și edițiile | Preț | Express |
---|---|---|
Paperback (1) | 933.10 lei 43-57 zile | |
Springer Us – 3 dec 2010 | 933.10 lei 43-57 zile | |
Hardback (1) | 940.53 lei 43-57 zile | |
Springer Us – 30 sep 1998 | 940.53 lei 43-57 zile |
Preț: 940.53 lei
Preț vechi: 1146.98 lei
-18% Nou
Puncte Express: 1411
Preț estimativ în valută:
179.100€ • 186.97$ • 149.51£
179.100€ • 186.97$ • 149.51£
Carte tipărită la comandă
Livrare economică 03-17 februarie 25
Preluare comenzi: 021 569.72.76
Specificații
ISBN-13: 9780792382720
ISBN-10: 0792382722
Pagini: 422
Ilustrații: XXXVI, 422 p.
Dimensiuni: 155 x 235 x 30 mm
Greutate: 0.86 kg
Ediția:1998
Editura: Springer Us
Colecția Springer
Locul publicării:New York, NY, United States
ISBN-10: 0792382722
Pagini: 422
Ilustrații: XXXVI, 422 p.
Dimensiuni: 155 x 235 x 30 mm
Greutate: 0.86 kg
Ediția:1998
Editura: Springer Us
Colecția Springer
Locul publicării:New York, NY, United States
Public țintă
ResearchCuprins
1 Introduction.- 2 SOI CMOS Technology.- 3 SOI CMOS Circuits.- 4 SOI CMOS Devices—Basic.- 5 SOI CMOS Devices—Advanced.- 6 SOI-Technology ST-SPICE.- 7 Special-Purpose SOI.