Design of CMOS RFIC Ultra-Wideband Impulse Transmitters and Receivers: SpringerBriefs in Electrical and Computer Engineering
Autor Cam Nguyen, Meng Miaoen Limba Engleză Paperback – 29 mar 2017
The book comprises seven chapters. The first chapter gives an introduction to UWB technology and outlines its suitability for high resolution sensing and high-rate, short-range ad-hoc networking and communications. The second chapter provides the basics of CMOS RFICs needed for the design of the UWB RFIC transmitter and receiver presented in this book. It includes the design fundamentals, lumped and distributed elements for RFIC, layout, post-layout simulation, and measurement. The third chapter discusses the basics of UWB systems including UWB advantages and applications, signals, basic modulations, transmitter and receiver frontends, and antennas. The fourth chapter addresses the design of UWB transmitters including an overview of basic components, design of pulse generator, BPSK modulator design, and design of a UWB tunable transmitter. Chapter 5 presents the design of UWB receivers including the design of UWB low-noise amplifiers, correlators, and a UWB 1 receiver. Chapter 6
covers the design of a UWB uniplanar antenna. Finally, a summary and conclusion is given in Chapter 7.
Din seria SpringerBriefs in Electrical and Computer Engineering
- Preț: 369.25 lei
- Preț: 366.63 lei
- Preț: 367.36 lei
- 20% Preț: 227.91 lei
- Preț: 366.46 lei
- 20% Preț: 368.28 lei
- Preț: 367.36 lei
- 20% Preț: 225.73 lei
- Preț: 366.46 lei
- 20% Preț: 224.75 lei
- Preț: 370.17 lei
- Preț: 366.46 lei
- Preț: 367.20 lei
- Preț: 432.06 lei
- Preț: 371.49 lei
- Preț: 367.36 lei
- Preț: 368.15 lei
- 20% Preț: 225.73 lei
- Preț: 366.08 lei
- Preț: 366.46 lei
- Preț: 366.63 lei
- Preț: 366.46 lei
- Preț: 365.72 lei
- Preț: 367.77 lei
- 20% Preț: 312.04 lei
- 20% Preț: 312.04 lei
- Preț: 367.00 lei
- Preț: 332.06 lei
- Preț: 334.49 lei
- Preț: 368.32 lei
- 20% Preț: 315.40 lei
- Preț: 366.83 lei
- Preț: 367.95 lei
- 20% Preț: 312.50 lei
- 20% Preț: 224.20 lei
- Preț: 363.66 lei
- Preț: 364.77 lei
- Preț: 349.82 lei
- Preț: 370.58 lei
- Preț: 367.56 lei
- Preț: 365.51 lei
- 20% Preț: 314.76 lei
- Preț: 369.25 lei
- Preț: 364.94 lei
- Preț: 366.46 lei
- 5% Preț: 351.51 lei
- Preț: 367.36 lei
- Preț: 364.40 lei
- Preț: 365.51 lei
- Preț: 332.06 lei
Preț: 356.37 lei
Nou
Puncte Express: 535
Preț estimativ în valută:
68.20€ • 71.52$ • 56.87£
68.20€ • 71.52$ • 56.87£
Carte tipărită la comandă
Livrare economică 04-10 ianuarie 25
Preluare comenzi: 021 569.72.76
Specificații
ISBN-13: 9783319531052
ISBN-10: 3319531050
Pagini: 172
Ilustrații: VIII, 113 p. 83 illus., 60 illus. in color.
Dimensiuni: 155 x 235 mm
Ediția:1st ed. 2017
Editura: Springer International Publishing
Colecția Springer
Seria SpringerBriefs in Electrical and Computer Engineering
Locul publicării:Cham, Switzerland
ISBN-10: 3319531050
Pagini: 172
Ilustrații: VIII, 113 p. 83 illus., 60 illus. in color.
Dimensiuni: 155 x 235 mm
Ediția:1st ed. 2017
Editura: Springer International Publishing
Colecția Springer
Seria SpringerBriefs in Electrical and Computer Engineering
Locul publicării:Cham, Switzerland
Cuprins
Introduction.- CMOS RFIC Design.- Fundamentals of UWB Systems.- UWB Transmitter Design.- UWB Receiver Design.- UWB Uniplanar Antenna.- Summary and Conclusion.
Notă biografică
Dr. Cam Nguyen joined the Department of Electrical and Computer Engineering of Texas A&M University in Dec. 1990, after working for more than twelve years in industry, where he now holds the position of Texas Instruments Endowed Professor.
He was with the National Science Foundation during 2003-2004 as Program Director of the Electronics, Photonics, and Device Technology Program and the Integrative Systems Program, responsible for research programs in RF electronics and wireless technologies. He was a Microwave Engineer with ITT Gilfillan Co., a Member of Technical Staff with Hughes Aircraft Co. (now Raytheon), and a Technical Specialist with Aeroject ElectroSystems Co. – all in California – a Member of Professional Staff with Martin Marietta Co. (now Lockheed-Martin) in Florida, and a Senior Staff Engineer and Program Manager at TRW (now Northrop Grumman) in California. While in industry, he led numerous RF, microwave and millimeter-wave activities. He also developed many RF, microwave and millimeter-wave integrated circuits and systems up to 220 GHz for communications, radar, and remote sensing.
He has published more than 240 papers, written 4 books and five book chapters, edited three books, and given more than 150 conference presentations and numerous invited presentations. Dr. Nguyen is the Founding Editor-in-Chief of Sensing and Imaging: An International Journal. He was also the Founding Chairman of the International Conference on Subsurface and Surface Sensing and Imaging Technologies and Applications.
He was with the National Science Foundation during 2003-2004 as Program Director of the Electronics, Photonics, and Device Technology Program and the Integrative Systems Program, responsible for research programs in RF electronics and wireless technologies. He was a Microwave Engineer with ITT Gilfillan Co., a Member of Technical Staff with Hughes Aircraft Co. (now Raytheon), and a Technical Specialist with Aeroject ElectroSystems Co. – all in California – a Member of Professional Staff with Martin Marietta Co. (now Lockheed-Martin) in Florida, and a Senior Staff Engineer and Program Manager at TRW (now Northrop Grumman) in California. While in industry, he led numerous RF, microwave and millimeter-wave activities. He also developed many RF, microwave and millimeter-wave integrated circuits and systems up to 220 GHz for communications, radar, and remote sensing.
He has published more than 240 papers, written 4 books and five book chapters, edited three books, and given more than 150 conference presentations and numerous invited presentations. Dr. Nguyen is the Founding Editor-in-Chief of Sensing and Imaging: An International Journal. He was also the Founding Chairman of the International Conference on Subsurface and Surface Sensing and Imaging Technologies and Applications.
Caracteristici
Includes supplementary material: sn.pub/extras