Cantitate/Preț
Produs

Diffusion Processes in Advanced Technological Materials

Editat de Devendra Gupta
en Limba Engleză Paperback – 2 ian 2013
My 12-year-old granddaughter Nina Alesi once asked me, "Grandpa, you are a scientist at IBM, so what do you do?" I tried to reply, "Oh, I watch atoms move. . . " But before I could finish this sentence, my 7-year-old grandson Vinnie interjected, "Grandpa, do atoms play soccer?" This book is about the games atoms play in diffusion and various other properties of materials. While diffusion has been studied for more than 100 years in solids, its importance, excitement, and intellectual chal­ lenges remain undiminished with time. It is central to understanding the relationship between the structure and properties of naturally occurring and synthetic materials, which is at the root of current technological development and innovations. The diversity of material has led to spec­ tacular progress in functional inorganics, polymers, granular materials, photonics, complex oxides, metallic glasses, quasi-crystals, and strongly correlated electronic materials. The integrity of complex materials pack­ ages is determined by diffusion, a highly interactive and synergic phe­ nomenon that interrelates to the microstructure, the microchemistry, and the superimposed physical fields. While the various physico-chemical properties of the materials are affected by diffusion, they determine diffu­ sion itself. This book, which is intended to document the diffusive processes operative in advanced technological materials, has been written by pio­ neers in industry and academia.
Citește tot Restrânge

Toate formatele și edițiile

Toate formatele și edițiile Preț Express
Paperback (1) 120694 lei  6-8 săpt.
  Springer Berlin, Heidelberg – 2 ian 2013 120694 lei  6-8 săpt.
Hardback (2) 87984 lei  5-7 săpt.
  ELSEVIER SCIENCE – 30 dec 2004 87984 lei  5-7 săpt.
  Springer Berlin, Heidelberg – 17 mar 2005 121440 lei  6-8 săpt.

Preț: 120694 lei

Preț vechi: 147188 lei
-18% Nou

Puncte Express: 1810

Preț estimativ în valută:
23106 24017$ 19157£

Carte tipărită la comandă

Livrare economică 07-21 februarie 25

Preluare comenzi: 021 569.72.76

Specificații

ISBN-13: 9783642060199
ISBN-10: 3642060196
Pagini: 552
Ilustrații: XVIII, 532 p.
Dimensiuni: 155 x 235 x 29 mm
Greutate: 0.73 kg
Ediția:2005
Editura: Springer Berlin, Heidelberg
Colecția Springer
Locul publicării:Berlin, Heidelberg, Germany

Public țintă

Research

Cuprins

Diffusion in Bulk Solids and Thin Films: Some Phenomenological Examples.- Solid State Diffusion and Bulk Properties.- Atomistic Computer Simulation of Diffusion.- Bulk and Grain Boundary Diffusion in Intermetallic Compounds.- Diffusion Barriers in Semiconductor Devices/Circuits.- Reactive Phase Formation: Some Theory and Applications.- Metal Diffusion in Polymers and on Polymer Surfaces.- Measurement of Stresses in Thin Films and Their Relaxation.- Electromigration in Cu Thin Films.- Diffusion in Some Perovskites: HTSC Cuprates and a Piezoelectric Ceramic.

Caracteristici

Emphasizes interrelated diffusion along multiple path, microstructure, micro-chemistry fields of all kinds, particularly of the interfaces Contains an entire chapter devoted to computer simulations of diffusion at the atomic level Treats high temperature applications Treats metal diffusion in polymers and on polymer surfaces Treats electromigration in copper thin films Treats newly discovered high temperature super conducting cuprates and some piezoelectric ceramics

Recenzii

"deserves a permanent place on the desk of many people ..." --Helmut Mehrer, Professor in Physics, Institut fnr Materialphysik, UniversitSt Mnnster, Germany