Diffusion Processes in Advanced Technological Materials
Editat de Devendra Guptaen Limba Engleză Paperback – 2 ian 2013
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Specificații
ISBN-13: 9783642060199
ISBN-10: 3642060196
Pagini: 552
Ilustrații: XVIII, 532 p.
Dimensiuni: 155 x 235 x 29 mm
Greutate: 0.73 kg
Ediția:2005
Editura: Springer Berlin, Heidelberg
Colecția Springer
Locul publicării:Berlin, Heidelberg, Germany
ISBN-10: 3642060196
Pagini: 552
Ilustrații: XVIII, 532 p.
Dimensiuni: 155 x 235 x 29 mm
Greutate: 0.73 kg
Ediția:2005
Editura: Springer Berlin, Heidelberg
Colecția Springer
Locul publicării:Berlin, Heidelberg, Germany
Public țintă
ResearchCuprins
Diffusion in Bulk Solids and Thin Films: Some Phenomenological Examples.- Solid State Diffusion and Bulk Properties.- Atomistic Computer Simulation of Diffusion.- Bulk and Grain Boundary Diffusion in Intermetallic Compounds.- Diffusion Barriers in Semiconductor Devices/Circuits.- Reactive Phase Formation: Some Theory and Applications.- Metal Diffusion in Polymers and on Polymer Surfaces.- Measurement of Stresses in Thin Films and Their Relaxation.- Electromigration in Cu Thin Films.- Diffusion in Some Perovskites: HTSC Cuprates and a Piezoelectric Ceramic.
Caracteristici
Emphasizes interrelated diffusion along multiple path, microstructure, micro-chemistry fields of all kinds, particularly of the interfaces Contains an entire chapter devoted to computer simulations of diffusion at the atomic level Treats high temperature applications Treats metal diffusion in polymers and on polymer surfaces Treats electromigration in copper thin films Treats newly discovered high temperature super conducting cuprates and some piezoelectric ceramics
Recenzii
"deserves a permanent place on the desk of many people ..." --Helmut Mehrer, Professor in Physics, Institut fnr Materialphysik, UniversitSt Mnnster, Germany