Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10–12, 2007, San Francisco, California, U.S.A.
Editat de Qinghuang Lin et al.
4 iun 2014
Paperback
Preț: 239.66 lei
6-8 săpt.