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Electromigration in ULSI Interconnections: Modeling, Analysis and Numerical Simulations de Cher Ming Tan

Electromigration in ULSI Interconnections: Modeling, Analysis and Numerical Simulations: International Series on Advances in Solid State Electronics and Technology (Unnumbered)

Autor Cher Ming Tan
en Limba Engleză Hardback – 24 iun 2010
Presents a description of the electro migration in integrated circuits. This book examines the various interconnected systems and their evolution employed in integrated circuit technology. It is suitable for readers on electro migration in ULSI interconnections.
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Din seria International Series on Advances in Solid State Electronics and Technology (Unnumbered)

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Specificații

ISBN-13: 9789814273329
ISBN-10: 9814273325
Pagini: 291
Dimensiuni: 155 x 229 x 23 mm
Greutate: 0.59 kg
Editura: WORLD SCIENTIFIC
Seria International Series on Advances in Solid State Electronics and Technology (Unnumbered)

Locul publicării:Singapore

Cuprins

Properties of Metals Used in ULSI Interconnections; Interconnection Reliability Modeling; ULSI Interconnect System and Its Evolution; Theoretical Study of EM; Numerical Study of EM; Experimental Study of EM for Al; Experimental Study of EM for Cu; Factors Affecting EM; Future Challenges of ULSI Interconnections.