ESSDERC ’89: 19th European Solid State Device Research Conference, Berlin
Editat de Anton Heuberger, Heiner Ryssel, Peter Langeen Limba Engleză Paperback – iul 2012
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Specificații
ISBN-13: 9783642523168
ISBN-10: 3642523161
Pagini: 996
Ilustrații: XXV, 963 p. 264 illus.
Dimensiuni: 155 x 235 x 52 mm
Greutate: 1.37 kg
Ediția:Softcover reprint of the original 1st ed. 1989
Editura: Springer Berlin, Heidelberg
Colecția Springer
Locul publicării:Berlin, Heidelberg, Germany
ISBN-10: 3642523161
Pagini: 996
Ilustrații: XXV, 963 p. 264 illus.
Dimensiuni: 155 x 235 x 52 mm
Greutate: 1.37 kg
Ediția:Softcover reprint of the original 1st ed. 1989
Editura: Springer Berlin, Heidelberg
Colecția Springer
Locul publicării:Berlin, Heidelberg, Germany
Public țintă
ResearchCuprins
From the Contents: Silicon and Compound Semiconductor Devices: MOS and Bipolar Structures.- New Devices, Submicron Devices.- III-V and II-VI Devices.- Quantum Well Devices and Heterostructures.- Lasers and Photodetectors.- Integrated Optoelectronics.- Sensors.- Cryogenic Devices.- Device Modelling.- Device Characterization.- Radiation Damage, Radiation Hardening.- Superconductivity in Semiconductor Devices.- Silicon and Compound Semiconductor Technology: Technology on III-V and II-VI Compounds.- Epitaxy Processes (LPE, MBE, MO-CVD,...).- Deposition Processes.- Plasma Processes.- Rapid Thermal Annealing.- Submicron Lithography.- Passivation.- Non-destructive Testing of Wafers, Layers, Devices.- Reliability and Defects.- Process Modelling.