Handbook of Thin Film Deposition
Editat de Krishna Seshanen Limba Engleză Hardback – 19 iul 2012
- A practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance and applications
- Covers core processes and applications in the semiconductor industry and new developments in the photovoltaic and optical thin film industries
- The new edition takes covers the transition taking place in the semiconductor world from Al/SiO2 to copper interconnects with low-k dielectrics
- Written by acknowledged industry experts from key companies in the semiconductor industry including Intel and IBM
- Foreword by Gordon E. Moore, co-founder of Intel and formulator of the renowned ‘Moore’s Law’ relating to the technology development cycle in the semiconductor industry
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Specificații
ISBN-13: 9781437778731
ISBN-10: 1437778739
Pagini: 408
Dimensiuni: 152 x 229 x 24 mm
Greutate: 0.72 kg
Ediția:Revised
Editura: ELSEVIER SCIENCE
ISBN-10: 1437778739
Pagini: 408
Dimensiuni: 152 x 229 x 24 mm
Greutate: 0.72 kg
Ediția:Revised
Editura: ELSEVIER SCIENCE
Public țintă
New third edition of the popular book on deposition. Aimed at engineers, technicians, and plant personnel in the semiconductor and related industries.Cuprins
Foreword to the Third Edition
Scaling of Devices and Thermal Scaling
PVD - Special Topics
CVD New Developments
CVD Equipment
CMP Method and Practice
Process Technology for Copper Interconnects
Optical Thin Films
Thin Films in Photovoltaics
Thin Films in Memory Applications
Index
Scaling of Devices and Thermal Scaling
PVD - Special Topics
CVD New Developments
CVD Equipment
CMP Method and Practice
Process Technology for Copper Interconnects
Optical Thin Films
Thin Films in Photovoltaics
Thin Films in Memory Applications
Index