Cărți de Harold S. Morgan

Modeling and Simulation Based Life-Cycle Engineering

Autor Ken Chong et al.

26 sep 2019

Preț: 490^.89 lei 577^.51 lei

6-8 săpt.

-15%

Mechanics of Solder Alloy Interconnects

Autor Darrel R. Frear et al.

30 ian 1994

Preț: 1283^.96 lei 1604^.96 lei

6-8 săpt.

-20%