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Heat Management in Integrated Circuits: Materials, Circuits and Devices

Autor Seda Ogrenci-Memik
en Limba Engleză Hardback – 30 noi 2015
This essential overview covers the subject of thermal monitoring and management in integrated circuits. Specifically, it focuses on devices and materials that are intimately integrated on-chip (as opposed to in-package or on-board) for the purposes of thermal monitoring and thermal management.
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Specificații

ISBN-13: 9781849199346
ISBN-10: 1849199345
Pagini: 304
Dimensiuni: 160 x 239 x 20 mm
Greutate: 0.59 kg
Editura: Institution of Engineering and Technology
Seria Materials, Circuits and Devices