High Mobility Materials for CMOS Applications: Woodhead Publishing Series in Electronic and Optical Materials
Editat de Nadine Collaerten Limba Engleză Paperback – 19 iun 2018
- Addresses each of the challenges of utilizing high mobility materials for CMOS applications, presenting possible solutions and the latest innovations
- Covers the latest advances in research on heterogeneous integration, gate stack, device design and scalability
- Provides a broad overview of the topic, from materials integration to circuits
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Specificații
ISBN-13: 9780081020616
ISBN-10: 0081020619
Pagini: 384
Dimensiuni: 152 x 229 mm
Greutate: 0.52 kg
Editura: ELSEVIER SCIENCE
Seria Woodhead Publishing Series in Electronic and Optical Materials
ISBN-10: 0081020619
Pagini: 384
Dimensiuni: 152 x 229 mm
Greutate: 0.52 kg
Editura: ELSEVIER SCIENCE
Seria Woodhead Publishing Series in Electronic and Optical Materials
Public țintă
Materials scientist researchers and electronic engineers in research and designCuprins
1. CMOS and Beyond CMOS: Scaling Challenges2. Opportunities for high mobility materials integrated on a Si platform3. Monolithic integration of InGaAs on Si(001) substrate for Logic devices4. III-N epitaxy on Si for power electronics5. Impact of defects on the performance of high-mobility semiconductor devices6. (Si)Ge devices7. III-V Devices and Technology for CMOS8. Beyond CMOS9. Optoelectronic devices integrated on silicon10. High mobility devices for digital applications