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High Mobility Materials for CMOS Applications: Woodhead Publishing Series in Electronic and Optical Materials

Editat de Nadine Collaert
en Limba Engleză Paperback – 19 iun 2018
High Mobility Materials for CMOS Applications provides a comprehensive overview of recent developments in the field of (Si)Ge and III-V materials and their integration on Si. The book covers material growth and integration on Si, going all the way from device to circuit design. While the book's focus is on digital applications, a number of chapters also address the use of III-V for RF and analog applications, and in optoelectronics. With CMOS technology moving to the 10nm node and beyond, however, severe concerns with power dissipation and performance are arising, hence the need for this timely work on the advantages and challenges of the technology.


  • Addresses each of the challenges of utilizing high mobility materials for CMOS applications, presenting possible solutions and the latest innovations
  • Covers the latest advances in research on heterogeneous integration, gate stack, device design and scalability
  • Provides a broad overview of the topic, from materials integration to circuits
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Specificații

ISBN-13: 9780081020616
ISBN-10: 0081020619
Pagini: 384
Dimensiuni: 152 x 229 mm
Greutate: 0.52 kg
Editura: ELSEVIER SCIENCE
Seria Woodhead Publishing Series in Electronic and Optical Materials


Public țintă

Materials scientist researchers and electronic engineers in research and design

Cuprins

1. CMOS and Beyond CMOS: Scaling Challenges2. Opportunities for high mobility materials integrated on a Si platform3. Monolithic integration of InGaAs on Si(001) substrate for Logic devices4. III-N epitaxy on Si for power electronics5. Impact of defects on the performance of high-mobility semiconductor devices6. (Si)Ge devices7. III-V Devices and Technology for CMOS8. Beyond CMOS9. Optoelectronic devices integrated on silicon10. High mobility devices for digital applications