Interconnects in VLSI Design
Editat de Hartmut Grabinskien Limba Engleză Paperback – 8 oct 2012
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Specificații
ISBN-13: 9781461369547
ISBN-10: 1461369541
Pagini: 248
Ilustrații: VII, 236 p.
Dimensiuni: 155 x 235 x 13 mm
Greutate: 0.35 kg
Ediția:2000
Editura: Springer Us
Colecția Springer
Locul publicării:New York, NY, United States
ISBN-10: 1461369541
Pagini: 248
Ilustrații: VII, 236 p.
Dimensiuni: 155 x 235 x 13 mm
Greutate: 0.35 kg
Ediția:2000
Editura: Springer Us
Colecția Springer
Locul publicării:New York, NY, United States
Public țintă
ResearchCuprins
Recent Development in Interconnect Modeling.- Study of Parallel Plane Mode Excitation at a Double-Layer Via Interconnect Using the FDTD Method.- A Testchip for Analysis of Signal Integrity and Ground-Bounce Effects in Deep-Submicron Technology.- Measurement of Signal Integrity within Deep-Submicron Interconnect.- Considering Magnetic Interference in Board-Level Interconnect Design.- Input Shape Influence over Interconnect Performances.- Comparison of RL and RLC Interconnect Models in the Simultaneous Switching Noise Simulations.- Black-Box Modeling of Digital Devices>.- Advanced Modeling of Nonuniform Interconnects.- Modeling of Passive Components for Radio Frequency Applications.- Electrical Performance of Capacitors Integrated in Multi-Layered Printed Circuit Boards.- Characteristic Impedance Measurement on Silicon.- Efficient Computation of the Parameters of Parallel Transmission Lines in IC Interconnects.- Modeling of Optical Interconnections for Data Transmission within High-Speed Electronic Systems.- Quantifying the Impact of Optical Interconnect Latency on the Performance of Optoelectronic FPGA’s.- PIN CMOS Receivers for Optical Interconnects.- BICMOS Receiver OEIC for Optical Interconnect.- Electrical/Optical Circuit Boards: Technology - Design - Modeling.