Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales
Autor Jianfeng Luo et al.
7 oct 2004
Hardback
Preț: 925.37 lei 1128.50 lei
6-8 săpt.
-18%
Cărți de Jianfeng Luo