Elements of Electromigration: Electromigration in 3D IC technology Autor King-Ning Tu et al. 19 ian 2024 Hardback Preț: 574.31 lei 675.65 lei 6-8 săpt. -15%
Solder Joint Technology: Materials, Properties, and Reliability Springer Series in Materials Science, nr. 92 Autor King-Ning Tu 22 aug 2007 Hardback Preț: 1378.42 lei 1681.00 lei 6-8 săpt. -18%
Electronic Thin-Film Reliability Autor King-Ning Tu 24 noi 2010 Hardback Preț: 457.18 lei 513.68 lei 6-8 săpt. -11%