Laser Processing of Thin Films and Microstructures: Oxidation, Deposition and Etching of Insulators: Springer Series in Materials Science, cartea 3
Autor Ian W. Boyden Limba Engleză Paperback – 15 dec 2011
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Specificații
ISBN-13: 9783642831386
ISBN-10: 3642831389
Pagini: 332
Ilustrații: VIII, 320 p.
Dimensiuni: 155 x 235 x 17 mm
Greutate: 0.47 kg
Ediția:Softcover reprint of the original 1st ed. 1987
Editura: Springer Berlin, Heidelberg
Colecția Springer
Seria Springer Series in Materials Science
Locul publicării:Berlin, Heidelberg, Germany
ISBN-10: 3642831389
Pagini: 332
Ilustrații: VIII, 320 p.
Dimensiuni: 155 x 235 x 17 mm
Greutate: 0.47 kg
Ediția:Softcover reprint of the original 1st ed. 1987
Editura: Springer Berlin, Heidelberg
Colecția Springer
Seria Springer Series in Materials Science
Locul publicării:Berlin, Heidelberg, Germany
Public țintă
ResearchCuprins
1. Introduction.- 1.1 Historical Background.- 1.2 Advantages of Laser Technology.- 1.3 Requirements for Laser Processing.- 1.4 Outline.- 2. Interaction and Kinetics.- 2.1 Laser Excitation of Matter.- 2.2 Laser Excitation of the Gas Species.- 2.3 Interaction of Laser Radiation with Solids.- 2.4 Interactions with Surfaces and Adsorbates.- 2.5 Laser-Induced Heating.- 2.6 Nucleation and Growth.- 2.7 Chemical Reactions and Growth Rates.- 3. Experimental Considerations.- 3.1 Properties of Laser Beams.- 3.2 Spatial Resolution.- 3.3 Modes of Laser Processing.- 3.4 The Choice of Laser.- 4. Laser-Assisted Oxidation and Nitridation.- 4.1 Oxidation.- 4.2 Background and Theory.- 4.3 Metal Oxidation.- 4.4 Silicon Oxidation.- 4.5 Oxidation of Compound Semiconductors.- 4.6 Nitridation.- 4.7 Laser Curing.- 5. Passivation by Laser Annealing and Melting.- 5.1 Modes of Laser Annealing.- 5.2 Laser Annealing in Oxygen.- 5.3 Oxygen Implantation.- 5.4 Nitrogen Implantation.- 5.5 Impurity Effects.- 5.6 Laser Cleaning of Surfaces.- 6. Laser-Induced Deposition.- 6.1 Background.- 6.2 Metal Oxides.- 6.3 Silicon Oxide.- 6.4 Silicon Nitride.- 6.5 Organic Polymer Formation.- 7. Material Removal.- 7.1 Introduction and Background.- 7.2 Etching.- 7.3 Ablation.- 7.4 Trimming.- 7.5 Cutting and Drilling.- 8. Summary and Conclusions.- 8.1 Properties and Applications.- 8.2 Future Prospects.- 8.3 Postscript.- References.