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MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics de Gordon Shaw III

MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics: Conference Proceedings of the Society for Experimental Mechanics Series

Editat de Gordon Shaw III, Barton C. Prorok, LaVern Starman, Cosme Furlong
en Limba Engleză Paperback – 23 aug 2016
MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering.  The collection presents early findings and case studies on a wide range of areas, including:
 
Microelectronics Packaging
Single Atom/Molecule Mechanical Testing
MEMS Devices & Fabrication
In-Situ Mechanical Testing
Nanoindentation
Experimental Analysis of Low-Dimensional Materials for Nanotechnology
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Specificații

ISBN-13: 9783319345628
ISBN-10: 3319345621
Pagini: 142
Ilustrații: VIII, 134 p. 124 illus.
Dimensiuni: 210 x 279 x 8 mm
Greutate: 0.34 kg
Ediția:Softcover reprint of the original 1st ed. 2014
Editura: Springer International Publishing
Colecția Springer
Seria Conference Proceedings of the Society for Experimental Mechanics Series

Locul publicării:Cham, Switzerland

Cuprins

From the Contents: Warpage Measurement of Simulated Electronic Packaging Assembly.- Nanomechanical Characterization of Lead Free Solder Joints.- In-Situ Surface Mount Process Characterization Using Digital Image Correlation.- Acoustic Waveform Energy as an Interconnect Damage Indicator.- Shape Optimization of Cantilevered Piezoelectric Devices.- Unique Fabrication Method for Novel MEMS Micro-contact Structure.- A Frequency Selective Surface Design Fabricated With Tunable RF Meta-atoms.- Stress Characterization in Si/SiO2 Spherical Shells Used in Micro-Robotics.

Textul de pe ultima copertă

MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering.  The collection presents early findings and case studies on a wide range of areas, including:
 
Microelectronics Packaging
Single Atom/Molecule Mechanical Testing
MEMS Devices & Fabrication
In-Situ Mechanical Testing
Nanoindentation
Experimental Analysis of Low-Dimensional Materials for Nanotechnology

Caracteristici

Includes supplementary material: sn.pub/extras